M7A3P1000-1PQ208I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP |
|---|---|
| Quantity | 950 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 154 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M7A3P1000-1PQ208I – ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP
The M7A3P1000-1PQ208I is a ProASIC3-series FPGA in a 208-BFQFP surface-mount package designed for industrial applications. It delivers mid-range programmable logic capacity with a balanced mix of logic elements, embedded memory and I/O to address control, signal-processing and interface tasks.
With 24,576 logic elements, approximately 0.147 Mbits of embedded memory and 154 I/O pins, this device targets designs that require substantial programmable logic resources in a compact 28 × 28 mm PQFP package while operating from a nominal 1.425 V to 1.575 V supply and an industrial temperature range.
Key Features
- Logic Capacity 24,576 logic elements and 1,000,000 gates provide substantial programmable logic for mid-density FPGA designs.
- Embedded Memory 147,456 bits of on-chip RAM (approximately 0.147 Mbits) for data buffering, state storage and small lookup tables.
- I/O Resources 154 general-purpose I/O pins to support multiple interfaces, peripheral connectivity and board-level flexibility.
- Power Supply Operates from a 1.425 V to 1.575 V core supply range to match system power domains and design constraints.
- Package & Mounting 208-BFQFP (supplier package: 208-PQFP 28×28) in a surface-mount format for board-level assembly and thermal considerations.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Environmental Compliance RoHS-compliant construction to meet common environmental and manufacturing requirements.
Typical Applications
- Industrial Control Implement motor control logic, PLC glue logic or deterministic control functions using programmable logic and ample I/O.
- Communications Equipment Provide protocol glue logic, parallel/serial interface aggregation and custom packet processing at the board level.
- Test & Measurement Create custom signal conditioning, data capture and instrument control functions leveraging on-chip memory and I/O.
- Embedded System Glue Offload bus bridging, peripheral interfacing and custom timing/sequencing in embedded platforms.
Unique Advantages
- High Logic Density: 24,576 logic elements and 1,000,000 gates enable complex combinational and sequential logic implementations without external hardware.
- On-Chip RAM: Approximately 0.147 Mbits of embedded memory supports buffering, FIFOs and small data stores directly on-chip to reduce external memory needs.
- Generous I/O Count: 154 I/O pins offer flexibility for multi-interface designs and board-level signal routing.
- Industrial Temperature Range: Rated −40 °C to 100 °C for reliable operation in demanding environments and extended temperature deployments.
- Industry-Standard Packaging: 208-BFQFP (208-PQFP, 28×28) surface-mount package simplifies mechanical integration on standard PCBs.
- RoHS Compliant: Environmentally compliant materials and manufacturing support modern assembly requirements.
Why Choose M7A3P1000-1PQ208I?
The M7A3P1000-1PQ208I positions itself as a mid-density ProASIC3 FPGA option for designers who need a balanced combination of logic, embedded memory and I/O in a compact surface-mount package. Its industrial temperature rating and RoHS compliance make it suitable for long-lived, fielded equipment where environmental margins matter.
Choose this device when your design calls for substantial on-chip logic and memory, flexible interfacing through many I/Os, and a standard PQFP footprint for PCB assembly—delivering a pragmatic blend of integration, configurability and deployment robustness.
Request a quote or submit an inquiry to get pricing and availability for the M7A3P1000-1PQ208I. Include your quantity and lead-time requirements to receive a tailored response.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
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