M7A3P1000-2FG144I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 97 147456 144-LBGA |
|---|---|
| Quantity | 815 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 97 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M7A3P1000-2FG144I – ProASIC3 Field Programmable Gate Array (FPGA) IC 97 147456 144-LBGA
The M7A3P1000-2FG144I is a ProASIC3 family FPGA from Microchip Technology designed for industrial embedded logic applications. It delivers 24,576 logic elements, roughly 147,456 bits of on-chip RAM, and up to 97 I/O pins in a 144-LBGA package, providing a compact, surface-mount programmable solution for medium-complexity designs.
With a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of -40°C to 100°C, this industrial-grade device is aimed at applications that require reliable operation across a wide thermal range and a clear, verifiable hardware resource set.
Key Features
- Core Logic — 24,576 logic elements (LEs) and approximately 1,000,000 gates to implement medium-density combinational and sequential logic functions.
- Embedded Memory — Approximately 0.147 Mbits (147,456 bits) of on-chip RAM for FIFOs, buffering, and state storage to support data-path and control logic.
- I/O Capability — 97 programmable I/O pins suitable for interfacing with peripherals, sensors, and external logic devices.
- Power — Operates from a defined supply range of 1.425 V to 1.575 V, enabling predictable power budgeting in regulated systems.
- Package & Mounting — 144-LBGA package (supplier device package: 144-FPBGA, 13×13) designed for surface-mount assembly in compact board layouts.
- Temperature & Grade — Industrial-grade device specified for operation from -40°C to 100°C for deployment in temperature-wide environments.
- Environmental Compliance — RoHS compliant to support regulatory requirements for lead-free assemblies.
Typical Applications
- Industrial Control — Implement custom control logic, motor-drive interfaces, and deterministic state machines where industrial temperature range and a defined logic capacity are required.
- Communications Interface — Bridge and protocol-conversion roles using the device's available I/Os and on-chip memory for buffering and timing control.
- Embedded System Glue Logic — Replace multiple discrete components with a single programmable device to consolidate interface logic and reduce board complexity.
Unique Advantages
- Balanced Resource Mix: Combines 24,576 logic elements with approximately 0.147 Mbits of RAM to support a wide range of mid-range FPGA designs without overprovisioning.
- Compact, Surface-Mount Package: The 144-LBGA (144-FPBGA, 13×13) footprint enables dense board layouts while keeping signal routing manageable.
- Industrial Temperature Rating: Specified for -40°C to 100°C operation, allowing deployment in harsh or variable environments where wider temperature tolerance is necessary.
- Predictable Power Envelope: Narrow supply window (1.425 V to 1.575 V) simplifies power-supply design and helps ensure consistent performance across units.
- RoHS Compliant: Meets lead-free environmental requirements for modern assembly processes.
Why Choose M7A3P1000-2FG144I?
The M7A3P1000-2FG144I positions itself as a practical, industrial-grade FPGA option for engineers seeking a reliable, mid-density programmable device. Its combination of 24,576 logic elements, on-chip RAM, and 97 I/Os in a compact 144-LBGA package makes it suitable for embedded control, interface consolidation, and communications tasks where consistent thermal and supply characteristics matter.
This device offers a straightforward resource profile that helps teams scale prototypes into production designs with predictable hardware requirements, while RoHS compliance and surface-mount packaging align with modern manufacturing practices.
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