M7A3P1000-2FG144I

IC FPGA 97 I/O 144FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 97 147456 144-LBGA

Quantity 815 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of M7A3P1000-2FG144I – ProASIC3 Field Programmable Gate Array (FPGA) IC 97 147456 144-LBGA

The M7A3P1000-2FG144I is a ProASIC3 family FPGA from Microchip Technology designed for industrial embedded logic applications. It delivers 24,576 logic elements, roughly 147,456 bits of on-chip RAM, and up to 97 I/O pins in a 144-LBGA package, providing a compact, surface-mount programmable solution for medium-complexity designs.

With a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of -40°C to 100°C, this industrial-grade device is aimed at applications that require reliable operation across a wide thermal range and a clear, verifiable hardware resource set.

Key Features

  • Core Logic — 24,576 logic elements (LEs) and approximately 1,000,000 gates to implement medium-density combinational and sequential logic functions.
  • Embedded Memory — Approximately 0.147 Mbits (147,456 bits) of on-chip RAM for FIFOs, buffering, and state storage to support data-path and control logic.
  • I/O Capability — 97 programmable I/O pins suitable for interfacing with peripherals, sensors, and external logic devices.
  • Power — Operates from a defined supply range of 1.425 V to 1.575 V, enabling predictable power budgeting in regulated systems.
  • Package & Mounting — 144-LBGA package (supplier device package: 144-FPBGA, 13×13) designed for surface-mount assembly in compact board layouts.
  • Temperature & Grade — Industrial-grade device specified for operation from -40°C to 100°C for deployment in temperature-wide environments.
  • Environmental Compliance — RoHS compliant to support regulatory requirements for lead-free assemblies.

Typical Applications

  • Industrial Control — Implement custom control logic, motor-drive interfaces, and deterministic state machines where industrial temperature range and a defined logic capacity are required.
  • Communications Interface — Bridge and protocol-conversion roles using the device's available I/Os and on-chip memory for buffering and timing control.
  • Embedded System Glue Logic — Replace multiple discrete components with a single programmable device to consolidate interface logic and reduce board complexity.

Unique Advantages

  • Balanced Resource Mix: Combines 24,576 logic elements with approximately 0.147 Mbits of RAM to support a wide range of mid-range FPGA designs without overprovisioning.
  • Compact, Surface-Mount Package: The 144-LBGA (144-FPBGA, 13×13) footprint enables dense board layouts while keeping signal routing manageable.
  • Industrial Temperature Rating: Specified for -40°C to 100°C operation, allowing deployment in harsh or variable environments where wider temperature tolerance is necessary.
  • Predictable Power Envelope: Narrow supply window (1.425 V to 1.575 V) simplifies power-supply design and helps ensure consistent performance across units.
  • RoHS Compliant: Meets lead-free environmental requirements for modern assembly processes.

Why Choose M7A3P1000-2FG144I?

The M7A3P1000-2FG144I positions itself as a practical, industrial-grade FPGA option for engineers seeking a reliable, mid-density programmable device. Its combination of 24,576 logic elements, on-chip RAM, and 97 I/Os in a compact 144-LBGA package makes it suitable for embedded control, interface consolidation, and communications tasks where consistent thermal and supply characteristics matter.

This device offers a straightforward resource profile that helps teams scale prototypes into production designs with predictable hardware requirements, while RoHS compliance and surface-mount packaging align with modern manufacturing practices.

Request a quote or submit an inquiry to get pricing, availability, and lead-time information for the M7A3P1000-2FG144I.

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