M7A3P1000-2FG484I

IC FPGA 300 I/O 484FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA

Quantity 215 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O300Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of M7A3P1000-2FG484I – ProASIC3 FPGA, 300 I/O, 484‑BGA

The M7A3P1000-2FG484I is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology. It provides a balance of logic density, on-chip memory and I/O capacity in a compact 484‑BGA surface-mount package.

With 24,576 logic elements, approximately 0.147 Mbits of embedded memory and up to 300 I/O pins, this device is suited to designs that require configurable logic, significant I/O connectivity and industrial-grade environmental tolerance.

Key Features

  • Core Logic  24,576 logic elements (cells) and an estimated 1,000,000 gates provide programmable combinational and sequential resources for complex logic implementation.
  • Embedded Memory  Approximately 0.147 Mbits of on-chip RAM to support buffering, state storage and small data tables within the FPGA fabric.
  • I/O Capacity  Up to 300 I/O pins to support a broad range of external interfaces and signal connectivity.
  • Power  Core voltage supply range of 1.425 V to 1.575 V for device operation.
  • Package and Mounting  484‑BGA (484‑FPBGA, 23×23) surface-mount package that enables high-density board integration.
  • Environmental and Grade  Industrial grade device with an operating temperature range of −40°C to 100°C and RoHS compliance for regulatory alignment.

Typical Applications

  • Industrial Control  Use where industrial-grade temperature range and configurable logic are required for control and monitoring tasks.
  • Embedded Systems  Integration into embedded designs that need moderate on-chip memory, sizable logic resources and substantial I/O count.
  • Communications and Interface  Implement protocol bridging, parallel/parallel-to-serial interfacing or custom I/O handling across up to 300 external signals.

Unique Advantages

  • High Logic Density: 24,576 logic elements and ~1,000,000 gates enable implementation of substantial custom logic without external ASICs.
  • On-Chip Memory: Approximately 0.147 Mbits of embedded RAM reduces dependence on external memory for small buffers and state machines.
  • Extensive I/O: Up to 300 I/O pins support complex interconnect requirements and diverse peripheral interfacing.
  • Industrial Temperature Range: Rated from −40°C to 100°C for deployment in harsh or temperature-variable environments.
  • Compact BGA Packaging: 484‑BGA (23×23) surface-mount package provides a high-density footprint suitable for space-constrained PCBs.
  • Regulatory Compliance: RoHS-compliant construction aligns with common environmental requirements.

Why Choose M7A3P1000-2FG484I?

The M7A3P1000-2FG484I combines a substantial logic element count, embedded memory and a large I/O complement in a single industrial-grade FPGA package from Microchip Technology. Its operating voltage range and wide temperature tolerance make it appropriate for designs that require reliable programmable logic under demanding environmental conditions.

This part is targeted at developers and procurement teams seeking a compact, high-density FPGA solution for systems that require configurable logic, significant I/O capacity and RoHS compliance while maintaining industrial temperature performance.

Request a quote or submit a product inquiry to get pricing and availability for the M7A3P1000-2FG484I.

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