M7A3P1000-2FGG144I

The M7A3P1000-2FGG144I is a ProASIC3 FPGA from Microchip Technology designed for industrial applications that require configurable logic in a compact package. It delivers a balance of logic density, on-chip memory, and I/O capacity for embedded control, interface, and system integration tasks.

Key Features

• Core Logic  Approximately 24,576 logic elements supporting roughly 1,000,000 gates, enabling complex digital logic implementations.
• Embedded Memory  Approximately 0.147 Mbits of on-chip RAM (147,456 total RAM bits) for implementing buffers, state machines, and small data structures without external memory.
• I/O Capacity  Up to 97 I/O pins, providing flexible connectivity for peripherals, buses, and external devices.
• Package & Mounting  144-LBGA package (supplier device package: 144-FPBGA, 13×13) in a surface-mount form factor for space-efficient board designs.
• Power  Single-supply operation in the range of 1.425 V to 1.575 V to match low-voltage system rails.
• Temperature & Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for reliable operation in demanding environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control and Automation  Industrial-grade rating and −40 °C to 100 °C operating range make the device suitable for controller logic, I/O aggregation, and protocol bridging in factory equipment.
• Embedded System Integration  With 24,576 logic elements and on-chip RAM, it supports glue-logic consolidation and custom peripheral integration on compact boards.
• Interface and Bus Bridging  A 97-pin I/O count supports diverse interface requirements for connecting sensors, actuators, and communication peripherals.
• Space-Constrained Designs  144-LBGA package and surface-mount mounting allow high-density placement on compact PCBs.

Unique Advantages

• Highly integrated logic capacity: Combining roughly 24,576 logic elements and ~1,000,000 gates reduces the need for multiple discrete components.
• On-chip memory availability: Approximately 0.147 Mbits of embedded RAM minimizes dependency on external memory for control and buffering tasks.
• Industrial-grade temperature range: Rated from −40 °C to 100 °C to support deployment in harsh or variable-temperature environments.
• Compact, manufacturable package: 144-LBGA (144-FPBGA 13×13) surface-mount package enables compact board layouts and automated assembly.
• Low-voltage operation: Supply range of 1.425 V to 1.575 V supports integration with modern low-voltage systems.
• Regulatory compliance: RoHS compliance supports environmental and regulatory requirements.

Why Choose M7A3P1000-2FGG144I?

The M7A3P1000-2FGG144I provides a practical combination of logic density, on-chip memory, and I/O capacity in an industrial-grade, compact LBGA package from Microchip Technology. Its specifications make it well suited for embedded designers and OEMs who need configurable logic for control, interface, and integration tasks while meeting environmental and temperature requirements.

Choose this part when you require a space-efficient FPGA solution with predictable on-chip resources, industrial temperature capability, and compliance with RoHS directives.

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