M7A3P1000-2FG256I

The M7A3P1000-2FG256I is a ProASIC3 Field Programmable Gate Array (FPGA) IC provided in a 256-LBGA package. It offers a hardware-configurable logic fabric with 24,576 logic elements and approximately 0.147 Mbits of embedded memory, aimed at industrial-grade programmable-logic applications.

With up to 1,000,000 gates, 177 user I/Os, a 1.425–1.575 V core supply window, and an operating temperature range of −40 °C to 100 °C, this device is suited for designs that require mid-density logic integration in a compact surface-mount BGA footprint.

Key Features

• Core Logic 24,576 logic elements (cells) delivering up to 1,000,000 gates for mid-density programmable logic implementations.
• Embedded Memory Approximately 0.147 Mbits of total on-chip RAM to support local buffering, small lookup tables, and state storage.
• I/O Count 177 user I/Os enabling connectivity to external peripherals, sensors, and interfaces in compact system designs.
• Package and Mounting Supplied in a 256-LBGA (256-FPBGA, 17×17) surface-mount package that balances board space and thermal/mechanical robustness.
• Power Core supply voltage range of 1.425 V to 1.575 V for consistent power provisioning across target systems.
• Thermal and Environmental Industrial-grade qualification with an operating temperature range from −40 °C to 100 °C and RoHS compliance.

Typical Applications

• Industrial Control — Programmable logic for control logic, I/O aggregation, and custom timing functions in industrial equipment that require industrial temperature operation.
• Embedded Systems — Mid-density FPGA resources for glue logic, protocol bridging, and peripheral management in embedded designs.
• Instrumentation and Test — Implement custom data handling, signal routing, and logic functions where a compact BGA package and industrial temperature range are required.

Unique Advantages

• Well-balanced logic density: 24,576 logic elements provide significant combinational and sequential resources without the footprint of high-density devices.
• Integrated on-chip RAM: Approximately 0.147 Mbits of embedded memory reduces external memory needs for small buffers and state machines.
• Robust I/O capacity: 177 user I/Os simplify board-level integration and support multiple signal interfaces from a single device.
• Industrial temperature performance: Rated from −40 °C to 100 °C, enabling deployment in temperature-challenging environments.
• Compact BGA packaging: 256-LBGA (17×17 FPBGA) combines a small PCB footprint with surface-mount mounting for modern assembly processes.
• Regulatory readiness: RoHS-compliant construction supports environmentally conscious manufacturing requirements.

Why Choose M7A3P1000-2FG256I?

The M7A3P1000-2FG256I positions itself as a mid-density, industrial-grade FPGA option that combines a substantial logic element count and on-chip RAM with a high I/O count in a compact 256-LBGA package. Its 1,000,000-gate capacity and 24,576 logic elements make it suitable for designs that need programmable flexibility without excessive board area or power overhead.

This device is appropriate for engineering teams developing industrial and embedded systems that require predictable thermal and electrical characteristics, RoHS compliance, and a surface-mount BGA footprint for modern PCB assembly. It provides a scalable, integrated building block for applications where mid-range logic resources and industrial operating range are key selection criteria.

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