M7A3P1000-1PQG208I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP |
|---|---|
| Quantity | 1,133 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 154 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M7A3P1000-1PQG208I – ProASIC3 FPGA, 154 I/Os, 208-BFQFP
The M7A3P1000-1PQG208I is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology. It delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact surface-mount package suitable for industrial applications.
Designed for use where robust operation and integration matter, this device targets embedded and industrial control markets that require reconfigurable logic, significant I/O count, and on-chip memory, while operating across a wide temperature and supply range.
Key Features
- Logic Capacity Provides 24,576 logic elements (LEs) and approximately 1,000,000 gates to implement complex custom logic and state machines.
- Embedded Memory Includes 147,456 bits of on-chip RAM—approximately 0.15 Mbits—useful for buffers, FIFOs, and small data structures without external memory.
- I/O Density Offers 154 general-purpose I/O pins to support multi-channel interfacing and signal aggregation in compact designs.
- Power Supply Operates from a voltage supply range of 1.425 V to 1.575 V, enabling straightforward core power design within specified limits.
- Package & Mounting Supplied in a 208-BFQFP package for surface-mount assembly; supplier device package listed as 208-PQFP (28x28).
- Industrial Temperature Range Specified to operate from −40 °C to 100 °C, matching requirements for many industrial and harsh-environment applications.
- Environmental Compliance RoHS compliant for adherence to common environmental regulations.
Typical Applications
- Industrial Automation and Control Use the device to implement custom control logic, sensor aggregation, and deterministic I/O handling across wide temperature ranges.
- Embedded System Integration Ideal for integrating multiple digital functions into a single programmable device to reduce board complexity in embedded platforms.
- I/O Expansion and Protocol Bridging Leverage 154 I/Os and on-chip memory for buffering and bridging between heterogeneous interfaces in compact system designs.
Unique Advantages
- High logic density: 24,576 logic elements and 1,000,000 gates provide headroom for sizeable custom logic implementations without multiple devices.
- On-chip memory for local buffering: Approximately 0.15 Mbits of embedded RAM reduces reliance on external memory for control and buffering tasks, simplifying BOM and board layout.
- Substantial I/O count: 154 I/Os allow consolidation of multiple signals and interfaces directly onto the FPGA, minimizing external glue logic.
- Industrial-grade thermal range: Rated from −40 °C to 100 °C to support deployments in demanding environments.
- Surface-mount 208-BFQFP package: Enables compact PCB footprint and standard assembly processes.
- Regulatory readiness: RoHS compliance supports regulatory and environmental requirements for many commercial and industrial products.
Why Choose M7A3P1000-1PQG208I?
The M7A3P1000-1PQG208I positions itself as a versatile ProASIC3 FPGA option that balances logic capacity, embedded memory, and I/O density in a single industrial-grade, surface-mount package. It is well suited to engineers building embedded control systems, I/O-intensive interfaces, and compact logic consolidation solutions where operating temperature and regulatory compliance are important.
Backed by Microchip Technology’s ProASIC3 family pedigree, this device offers a clear path for designs that need reliable, reconfigurable logic with on-chip memory and substantial I/O—helping reduce board complexity and supporting longer-term product robustness.
Request a quote or submit an inquiry to discuss availability, pricing, and lead times for the M7A3P1000-1PQG208I. Our team can provide the details you need to move your design forward.

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