M7A3P1000-1FGG484I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA |
|---|---|
| Quantity | 1,354 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 300 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M7A3P1000-1FGG484I – ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA
The M7A3P1000-1FGG484I is a ProASIC3 field programmable gate array from Microchip Technology. It provides a mid-range integration point for designs requiring substantial logic resources, on-chip memory, and a high I/O count within a compact BGA package.
With 24,576 logic elements, approximately 1,000,000 gates, 147,456 bits of embedded RAM, and 300 I/O pins, this surface-mount device is targeted at embedded systems and industrial applications that need predictable supply and operating temperature ranges.
Key Features
- Logic Capacity 24,576 logic elements supporting approximately 1,000,000 logic gates for implementing complex digital functions.
- Embedded Memory Approximately 0.147 Mbits of on-chip RAM (147,456 total RAM bits) for buffers, FIFOs, and small data stores.
- I/O Resources 300 general-purpose I/O pins to support multiple interfaces and parallel connections.
- Power Device supply voltage range of 1.425 V to 1.575 V for controlled power delivery design.
- Package & Mounting Surface-mount 484-BGA package (484-FPBGA, 23×23) enabling high pin density in a compact footprint.
- Operating Range Industrial-grade temperature range from -40 °C to 100 °C for use in demanding environments.
- Environmental Compliance RoHS compliant to support environmentally conscious manufacturing requirements.
Unique Advantages
- Significant logic density: 24,576 logic elements and roughly 1,000,000 gates allow implementation of substantial digital functions without external logic.
- Integrated memory resources: Approximately 0.147 Mbits of embedded RAM reduces dependence on external memory for small buffering and state storage.
- High I/O count: 300 I/O pins provide flexibility for multiple peripherals, parallel buses, and mixed-signal front-ends.
- Compact, high-pin-count package: 484-BGA (23×23) offers a dense physical solution for board space-constrained applications.
- Industrial temperature capability: Rated from -40 °C to 100 °C to support deployment in harsh or temperature-variable environments.
- Environmental compliance: RoHS status supports regulated manufacturing and end-product requirements.
Why Choose M7A3P1000-1FGG484I?
The M7A3P1000-1FGG484I combines substantial logic and memory resources with a high I/O count in a compact 484-BGA surface-mount package, making it well suited for mid-range embedded and industrial designs that demand both integration and thermal robustness. Its specified supply voltage range and industrial operating temperature help ensure predictable behavior in controlled-power and wide-temperature environments.
Manufactured by Microchip Technology, this ProASIC3 device is a practical option for engineering teams seeking a reliable, RoHS-compliant FPGA platform with a clear set of hardware resources for scalable designs.
Request a quote or submit a pricing and availability inquiry to get more information or to place an order for the M7A3P1000-1FGG484I.

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