M7A3P1000-1FGG256I

IC FPGA 177 I/O 256FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 177 147456 256-LBGA

Quantity 1,174 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O177Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of M7A3P1000-1FGG256I – ProASIC3 Field Programmable Gate Array (FPGA) IC, 177 I/O, 147,456-bit RAM, 256-LBGA

The M7A3P1000-1FGG256I is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial applications. It provides a balanced combination of logic capacity, embedded memory and I/O density in a compact 256-pin BGA package.

With 24,576 logic elements, approximately 0.147 Mbits of on-chip RAM, and up to 177 I/O, this device targets embedded and industrial systems that require mid-range programmable logic, a defined operating voltage window, and an extended temperature range.

Key Features

  • Core Logic — 24,576 logic elements (cells) delivering up to 1,000,000 equivalent gates for implementing custom digital functions.
  • Embedded Memory — 147,456 total RAM bits (approximately 0.147 Mbits) for on-chip data buffering and state storage.
  • I/O Density — 177 user I/O pins to support multiple interfaces and signal routing requirements.
  • Power — Defined supply range of 1.425 V to 1.575 V for core operation.
  • Package — 256-LBGA package (supplier device package 256-FPBGA, 17×17) in a surface-mount form factor to suit compact board layouts.
  • Industrial Grade & Temperature Range — Specified for industrial operation from −40 °C to 100 °C.
  • Compliance — RoHS compliant to meet regulatory requirements for lead-free assembly.

Typical Applications

  • Industrial Control — Implement custom control logic and interfaces for factory automation and process control, leveraging the industrial temperature rating for reliable operation.
  • Embedded Systems — Integrate mid-range programmable logic and on-chip RAM to handle system glue logic, protocol handling and data buffering in compact products.
  • Interface Bridging — Use available I/O count to consolidate multiple interface conversions, signal aggregations, or bespoke peripheral interfaces.
  • Communication Modules — Implement protocol processing and timing-critical logic where a combination of logic elements and embedded RAM is required.

Unique Advantages

  • High Logic Density: 24,576 logic elements provide substantial capacity for custom digital designs without external logic expansion.
  • Integrated Memory: 147,456 bits of on-chip RAM reduce dependence on external memory for many control and buffering tasks.
  • Generous I/O Count: 177 I/O pins enable multiple peripheral connections and flexible board-level integration.
  • Industrial Temperature Capability: Rated from −40 °C to 100 °C to meet the demands of industrial environments.
  • Compact Surface-Mount Package: 256-LBGA (256-FPBGA, 17×17) supports dense PCB layouts while maintaining robust connectivity.
  • Regulatory Compliance: RoHS compliant for lead-free manufacturing processes.

Why Choose M7A3P1000-1FGG256I?

The M7A3P1000-1FGG256I positions itself as a practical mid-range FPGA option for industrial and embedded designs that require a clear balance of logic capacity, embedded RAM and I/O resources in a compact BGA package. Its defined supply window and extended temperature rating support robust operation in demanding environments.

Manufactured by Microchip Technology, this device suits designers needing a programmable logic solution with predictable electrical and thermal characteristics, a high I/O count, and on-chip memory for streamlined system architectures.

Request a quote or contact sales to discuss pricing, availability and how the M7A3P1000-1FGG256I can fit into your next design.

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