M7A3P1000-2FGG144

IC FPGA 97 I/O 144FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 97 147456 144-LBGA

Quantity 12 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of M7A3P1000-2FGG144 – ProASIC3 Field Programmable Gate Array (FPGA) IC 97 147456 144-LBGA

The M7A3P1000-2FGG144 is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology. It delivers a mid-density, commercial-grade programmable logic solution in a compact 144-LBGA package.

With 24,576 logic elements, approximately 0.147 Mbits of embedded RAM, 97 I/O pins and 1,000,000 gates, this device is positioned for commercial embedded designs that require on‑chip logic, memory and flexible I/O in a surface-mount package. It operates from a 1.425 V to 1.575 V supply and is specified for 0 °C to 85 °C operation.

Key Features

  • Core Logic — 24,576 logic elements provide the programmable logic capacity for custom digital functions and glue logic.
  • Embedded Memory — 147,456 total RAM bits (approximately 0.147 Mbits) for on-chip buffering, state storage and small data structures.
  • I/O and Gate Count — 97 user I/O pins and 1,000,000 gates to support interfacing and logic complexity.
  • Power — Operates from a 1.425 V to 1.575 V supply range, suitable for systems designed around this voltage domain.
  • Package & Mounting — 144-LBGA package (supplier device package: 144-FPBGA 13×13); surface-mount mounting for compact PCB integration.
  • Operating Conditions & Compliance — Commercial grade device specified for 0 °C to 85 °C and RoHS compliant for environmental regulatory alignment.

Typical Applications

  • Commercial Embedded Systems — Implement custom control logic and system orchestration where a commercial‑grade FPGA is required.
  • Interface and Glue Logic — Replace discrete components by consolidating protocol conversion, bus interfacing and timing logic on chip using available I/O and logic elements.
  • Prototyping and Evaluation — Validate and iterate digital designs with on‑chip memory and a substantial logic element count.
  • Custom Digital Modules — Implement small to mid-scale digital accelerators, finite state machines and control blocks within a compact LBGA footprint.

Unique Advantages

  • High programmable density: 24,576 logic elements and 1,000,000 gates enable substantial logic integration in a single device, reducing external component count.
  • On-chip memory for buffering: 147,456 bits of RAM provide local storage for state machines, FIFOs or small data tables, improving system integration.
  • Ample I/O connectivity: 97 I/O pins allow flexible interfacing with peripherals, sensors and external logic without immediate need for expanders.
  • Compact surface-mount package: 144-LBGA (144-FPBGA 13×13) supports densely populated PCBs and space-constrained designs.
  • Commercial temperature rating: Rated for 0 °C to 85 °C to match typical commercial electronic product environments.
  • RoHS compliant: Conforms to RoHS requirements for environmentally conscious manufacturing.

Why Choose M7A3P1000-2FGG144?

The M7A3P1000-2FGG144 combines a practical balance of logic density, embedded memory and I/O in a compact 144-LBGA package, making it suitable for commercial embedded designs that require integrated programmable logic. Its specified supply range and operating temperature make it a clear option for systems designed within commercial operating envelopes.

Backed by Microchip Technology, this ProASIC3 device fits designs that need mid-density FPGA resources with on‑chip RAM and substantial I/O capability, helping reduce board-level complexity and shorten development iterations.

Request a quote or submit an inquiry to receive pricing and availability information for the M7A3P1000-2FGG144.

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