M7A3P1000-2FGG256

The M7A3P1000-2FGG256 is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology provided in a 256-LBGA surface-mount package. It delivers a balance of on-chip logic, embedded memory and a sizable I/O count for commercial FPGA designs.

With 24,576 logic elements, approximately 0.147 Mbits of embedded memory and 177 I/O pins, this device supports configurable digital logic, interface bridging and mid-density integration in commercial-temperature applications.

Key Features

• Core Logic 24,576 logic elements (cells) and approximately 1,000,000 gates for mid-density programmable logic integration.
• Embedded Memory Approximately 0.147 Mbits of on-chip RAM (147,456 total RAM bits) to support buffers, FIFOs and scratch storage directly on silicon.
• I/O Capacity 177 programmable I/O pins to support multiple interfaces and signal counts in compact designs.
• Power Nominal device supply voltage range of 1.425 V to 1.575 V to align with targeted system power rails.
• Package & Mounting 256-LBGA package (supplier package: 256-FPBGA, 17×17) optimized for surface-mount assembly and space-constrained PCBs.
• Temperature & Grade Commercial grade operation from 0 °C to 85 °C for standard commercial-environment applications.
• Environmental Compliance RoHS compliant to meet common regulatory requirements for lead-free assemblies.

Typical Applications

• Custom Logic and Control Implement state machines, control logic and protocol handling using the device’s 24,576 logic elements and gate capacity.
• I/O-Intensive Interface Bridging Use the 177 I/O pins for parallel interfaces, bus bridging or multi-signal connectivity in compact systems.
• Embedded Memory-Dependent Functions Leverage approximately 0.147 Mbits of on-chip RAM for temporary storage, buffering and small data structures without external memory.
• Space-Constrained Board Designs The 256-LBGA (256-FPBGA 17×17) surface-mount package supports dense, compact PCB layouts.

Unique Advantages

• Balanced Mid-Density Logic: 24,576 logic elements provide ample capacity for complex combinational and sequential designs without overspecifying resources.
• Integrated On-Chip Memory: Approximately 0.147 Mbits of embedded RAM reduces the need for small external memory devices and simplifies board design.
• High I/O Count: 177 I/O pins enable flexible interfacing with multiple peripherals and buses, minimizing external multiplexing.
• Compact, Surface-Mount Package: The 256-LBGA (256-FPBGA, 17×17) footprint supports high-density PCB implementations while remaining surface-mount friendly.
• Commercial Temperature Rated: Rated for 0 °C to 85 °C operation to match typical commercial environment requirements.
• Regulatory-Friendly: RoHS compliance supports lead-free manufacturing and regulatory alignment.

Why Choose M7A3P1000-2FGG256?

The M7A3P1000-2FGG256 positions itself as a practical mid-density FPGA option for commercial designs that require a combination of substantial logic resources, on-chip memory and a generous I/O count in a compact BGA package. Its supply voltage range and commercial temperature rating make it suitable for a wide range of standard embedded applications.

Designed and manufactured by Microchip Technology, the device offers a predictable set of hardware resources—24,576 logic elements, approximately 0.147 Mbits of embedded RAM, 177 I/O and a 256-LBGA package—delivering straightforward integration and long-term availability for production designs.

If you would like pricing, availability or a formal quote for the M7A3P1000-2FGG256, submit a request or inquiry and our team will respond with next steps.