M7A3P1000-2FGG256I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 177 147456 256-LBGA |
|---|---|
| Quantity | 1,216 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 177 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M7A3P1000-2FGG256I – ProASIC3 Field Programmable Gate Array (FPGA), 177 I/O, 256-LBGA
The M7A3P1000-2FGG256I is a ProASIC3 family FPGA IC from Microchip Technology, delivered in a 256-LBGA package. It provides a balance of on-chip logic capacity, embedded memory, and I/O density for industrial-grade embedded system designs.
With 24,576 logic elements, approximately 0.147 Mbits of embedded RAM, and 177 user I/Os, this surface-mount FPGA is aimed at industrial applications that require reconfigurable logic, moderate on-chip buffering, and a compact 256-ball package. The device supports a core supply range of 1.425 V to 1.575 V and an operating temperature range of −40°C to 100°C.
Key Features
- Core Logic 24,576 logic elements (cells) providing a total of 1,000,000 logical gates for implementing custom digital logic and control functions.
- Embedded Memory 147,456 bits of on-chip RAM (approximately 0.147 Mbits) to support buffering, small data structures, and state storage within the FPGA fabric.
- I/O Density 177 user I/Os for flexible external interfacing and consolidation of multiple digital signals into a single programmable device.
- Power Core supply voltage specified from 1.425 V to 1.575 V to match system power domains and ensure predictable power behavior.
- Package & Mounting 256-ball LBGA package (supplier device package: 256-FPBGA, 17 × 17 mm) in a surface-mount form factor for compact PCB integration.
- Industrial Temperature Range Rated for operation from −40°C to 100°C, suitable for applications requiring extended temperature tolerance.
- Regulatory RoHS compliant to support lead-free assembly and regulatory requirements for many production environments.
Typical Applications
- Industrial Control Implement custom control logic and I/O consolidation for factory automation and machine control within industrial temperature conditions.
- Interface Bridging Use the device’s abundant I/Os and reprogrammability to consolidate protocol translation or signal interfacing tasks on a single IC.
- Embedded System Logic Integrate custom finite-state machines, timing logic, and small data buffers using the provided logic elements and on-chip RAM.
Unique Advantages
- High usable logic capacity: 24,576 logic elements enable implementation of substantial custom digital functions without external ASICs.
- Compact package: 256-LBGA (256-FPBGA, 17×17 mm) provides a space-efficient footprint for dense board layouts.
- Significant I/O resources: 177 user I/Os allow consolidation of multiple interfaces and reduce the need for additional I/O-expander components.
- Industrial suitability: −40°C to 100°C operating range and RoHS compliance support deployment in industrial environments with lead-free assembly needs.
- Predictable power domain: Defined core voltage range (1.425 V–1.575 V) simplifies power-supply planning for system integration.
Why Choose M7A3P1000-2FGG256I?
The M7A3P1000-2FGG256I positions itself as a versatile, industrial-grade FPGA option offering a strong mix of logic capacity, embedded memory, and I/O count in a compact 256-ball package. It is well suited for engineers designing reconfigurable digital logic into industrial systems where temperature tolerance and a predictable power envelope are required.
Backed by Microchip Technology, this ProASIC3 device provides a pragmatic balance of performance and integration for mid-density FPGA tasks, helping reduce component count and simplify board-level design while supporting production needs with RoHS compliance.
If you would like pricing or availability for M7A3P1000-2FGG256I, request a quote or submit an inquiry to purchase today.

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