M7A3P1000-2FGG256I

IC FPGA 177 I/O 256FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 177 147456 256-LBGA

Quantity 1,216 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O177Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of M7A3P1000-2FGG256I – ProASIC3 Field Programmable Gate Array (FPGA), 177 I/O, 256-LBGA

The M7A3P1000-2FGG256I is a ProASIC3 family FPGA IC from Microchip Technology, delivered in a 256-LBGA package. It provides a balance of on-chip logic capacity, embedded memory, and I/O density for industrial-grade embedded system designs.

With 24,576 logic elements, approximately 0.147 Mbits of embedded RAM, and 177 user I/Os, this surface-mount FPGA is aimed at industrial applications that require reconfigurable logic, moderate on-chip buffering, and a compact 256-ball package. The device supports a core supply range of 1.425 V to 1.575 V and an operating temperature range of −40°C to 100°C.

Key Features

  • Core Logic 24,576 logic elements (cells) providing a total of 1,000,000 logical gates for implementing custom digital logic and control functions.
  • Embedded Memory 147,456 bits of on-chip RAM (approximately 0.147 Mbits) to support buffering, small data structures, and state storage within the FPGA fabric.
  • I/O Density 177 user I/Os for flexible external interfacing and consolidation of multiple digital signals into a single programmable device.
  • Power Core supply voltage specified from 1.425 V to 1.575 V to match system power domains and ensure predictable power behavior.
  • Package & Mounting 256-ball LBGA package (supplier device package: 256-FPBGA, 17 × 17 mm) in a surface-mount form factor for compact PCB integration.
  • Industrial Temperature Range Rated for operation from −40°C to 100°C, suitable for applications requiring extended temperature tolerance.
  • Regulatory RoHS compliant to support lead-free assembly and regulatory requirements for many production environments.

Typical Applications

  • Industrial Control Implement custom control logic and I/O consolidation for factory automation and machine control within industrial temperature conditions.
  • Interface Bridging Use the device’s abundant I/Os and reprogrammability to consolidate protocol translation or signal interfacing tasks on a single IC.
  • Embedded System Logic Integrate custom finite-state machines, timing logic, and small data buffers using the provided logic elements and on-chip RAM.

Unique Advantages

  • High usable logic capacity: 24,576 logic elements enable implementation of substantial custom digital functions without external ASICs.
  • Compact package: 256-LBGA (256-FPBGA, 17×17 mm) provides a space-efficient footprint for dense board layouts.
  • Significant I/O resources: 177 user I/Os allow consolidation of multiple interfaces and reduce the need for additional I/O-expander components.
  • Industrial suitability: −40°C to 100°C operating range and RoHS compliance support deployment in industrial environments with lead-free assembly needs.
  • Predictable power domain: Defined core voltage range (1.425 V–1.575 V) simplifies power-supply planning for system integration.

Why Choose M7A3P1000-2FGG256I?

The M7A3P1000-2FGG256I positions itself as a versatile, industrial-grade FPGA option offering a strong mix of logic capacity, embedded memory, and I/O count in a compact 256-ball package. It is well suited for engineers designing reconfigurable digital logic into industrial systems where temperature tolerance and a predictable power envelope are required.

Backed by Microchip Technology, this ProASIC3 device provides a pragmatic balance of performance and integration for mid-density FPGA tasks, helping reduce component count and simplify board-level design while supporting production needs with RoHS compliance.

If you would like pricing or availability for M7A3P1000-2FGG256I, request a quote or submit an inquiry to purchase today.

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