M7A3P1000-2FGG484
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA |
|---|---|
| Quantity | 1,265 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 300 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M7A3P1000-2FGG484 – ProASIC3 Field Programmable Gate Array (FPGA), 300 I/O, ~0.15 Mbits, 484-BGA
The M7A3P1000-2FGG484 is a ProASIC3 flash-based FPGA in a 484-ball BGA package designed for commercial applications. It delivers a balanced mix of programmable logic, on-chip memory and high I/O density for board-level integration where a single-chip programmable solution is required.
With 24,576 logic elements, approximately 0.15 Mbits of embedded RAM, and 300 user I/O pins, this device is suited to designs that require substantial gate count and flexible I/O while maintaining a single supply domain and commercial-grade environmental range.
Key Features
- Core Logic 24,576 logic elements (cells) providing a large programmable fabric for implementing custom digital functions and one million equivalent gates.
- Embedded Memory Approximately 0.15 Mbits of on-chip RAM to support buffering, small data storage and state machines without external memory.
- I/O Density 300 user I/O pins enable high-connectivity designs and flexible interfacing to external peripherals and board-level signals.
- Power Single core supply range of 1.425 V to 1.575 V for straightforward power rail planning.
- Package & Mounting 484-ball FPBGA (23×23) surface-mount package for compact board-level implementation and high I/O routing capability.
- Operating Range & Grade Commercial-grade device specified for 0 °C to 85 °C operating temperature and RoHS compliance for regulatory compatibility.
Typical Applications
- Commercial Embedded Systems Programmable logic and I/O consolidation for board-level control and interface handling in commercial equipment where a high gate count and many I/Os are required.
- Prototyping and Development Hardware prototyping and design validation that benefit from reprogrammable logic with substantial logic element and memory resources.
- I/O Aggregation and Interface Bridging Consolidating multiple board signals and custom protocol interfacing using the device's high I/O count and programmable fabric.
Unique Advantages
- High Logic Capacity: 24,576 logic elements provide ample programmable resources to implement complex combinational and sequential logic without external ASICs.
- Integrated Memory: Approximately 0.15 Mbits of embedded RAM reduces dependency on external memory for small buffers and state storage, simplifying BOM and board layout.
- Robust I/O Count: 300 user I/Os enable dense interfacing and flexible signal routing across a wide range of board functions.
- Compact BGA Package: 484-FPBGA (23×23) surface-mount package offers a compact footprint while supporting many I/Os for space-constrained designs.
- Commercial Operating Range: Specified 0 °C to 85 °C operation and RoHS compliance align the device with commercial product requirements and regulatory needs.
- Single Supply Integration: Narrow core supply range (1.425 V–1.575 V) helps simplify power supply design and regulation on the PCB.
Why Choose M7A3P1000-2FGG484?
The M7A3P1000-2FGG484 positions itself as a commercial-grade programmable logic solution that combines significant logic density, on-chip memory and a high count of user I/Os in a compact BGA package. Its specification set supports designers who need to integrate complex digital functions and extensive interfacing without resorting to multiple discrete devices.
This device is well suited for teams developing commercial embedded products, prototypes, or board-level interface controllers who require a balance of integration, predictable operating conditions, and RoHS compliance. The combination of logic elements, RAM and I/O density offers a scalable platform for a variety of commercial FPGA-based designs.
Request a quote or submit an inquiry to receive pricing and availability information for the M7A3P1000-2FGG484 and to discuss how it fits your design requirements.

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