M7A3P1000-2PQG208

The M7A3P1000-2PQG208 is a ProASIC3 FPGA from Microchip Technology. It offers a blend of configurable logic, embedded RAM and a substantial I/O count in a commercial-grade, surface-mount package.

Key device characteristics include 24,576 logic elements, approximately 0.15 Mbits of on-chip RAM (147,456 bits), 154 I/Os and a 1,000,000-gate capacity. The device is supplied in a 208-BFQFP package (supplier device package: 208-PQFP 28×28), operates from 1.425 V to 1.575 V, and is specified for 0 °C to 85 °C operation. The part is RoHS compliant.

Key Features

• Core Architecture  ProASIC3 FPGA device from Microchip Technology providing programmable logic for custom digital functions.
• Logic Capacity  24,576 logic elements and approximately 1,000,000 gates enable substantial user-defined logic implementation.
• Embedded Memory  Approximately 0.15 Mbits of on-chip RAM (147,456 bits) for local buffering and state storage.
• I/O Resources  154 I/O pins to support interfacing with peripherals, sensors and external buses without extensive external glue logic.
• Power  Device supply voltage specified at 1.425 V to 1.575 V for predictable power integration.
• Package & Mounting  208-BFQFP (supplier: 208-PQFP 28×28) in a surface-mount form factor for PCB-level integration.
• Operating Range & Compliance  Commercial-grade operation from 0 °C to 85 °C and RoHS compliant for regulatory alignment in commercial products.

Typical Applications

• Commercial embedded systems  Implements custom logic functions and board-level integration in commercial electronic products.
• OEM product designs  Integrates programmable logic and on-chip RAM to reduce external component count in OEM assemblies.
• Interface and peripheral control  Uses the device’s 154 I/Os and logic resources to implement protocol bridging, I/O aggregation and peripheral control.

Unique Advantages

• High logic density:  24,576 logic elements and 1,000,000 gates provide ample capacity for complex programmable designs.
• Integrated on-chip RAM:  Approximately 0.15 Mbits of embedded memory reduces dependency on external RAM for small buffers and state machines.
• Broad I/O availability:  154 I/Os help minimize the need for external multiplexers or expanders in many designs.
• Compact surface-mount package:  208-BFQFP / 208-PQFP (28×28) supports dense PCB layouts and standard assembly processes.
• Predictable electrical envelope:  Narrow supply range (1.425 V–1.575 V) and defined operating temperature simplify power and thermal planning.
• Regulatory readiness:  RoHS compliance supports deployment in commercial markets with environmental requirements.

Why Choose M7A3P1000-2PQG208?

The M7A3P1000-2PQG208 delivers a balanced combination of configurable logic, embedded memory and a high I/O count in a compact surface-mount package. Its specifications suit commercial-grade designs that require predictable electrical and thermal parameters and on-chip resources to consolidate functionality.

This ProASIC3 device is appropriate for engineers and product teams seeking a Microchip Technology FPGA with measurable logic capacity, defined supply and temperature ranges, and RoHS compliance for commercial product integration.

Request a quote or submit a purchase inquiry for the M7A3P1000-2PQG208 to evaluate its fit for your next commercial embedded design.