M7A3P1000-2FGG484I

The M7A3P1000-2FGG484I is a ProASIC3 family field programmable gate array from Microchip Technology, delivered in a 484-ball BGA package. It provides reconfigurable digital logic resources and abundant I/O suitable for industrial embedded designs.

This device combines 24,576 logic elements, approximately 0.147 Mbits of embedded memory, and 300 I/O pins with a 1.425–1.575 V supply range and an operating temperature range of −40 °C to 100 °C, offering a compact, industrial-grade FPGA option for designs that require high integration and robust environmental performance.

Key Features

• Core Logic  24,576 logic elements (equivalent to the device's CLB/LAB resources) and approximately 1,000,000 gates for implementing custom digital functions and combinational/sequential logic.
• On-Chip Memory  Total on-chip RAM of 147,456 bits (approximately 0.147 Mbits) to support buffering, FIFOs, and small data structures without external memory.
• I/O Density  300 user I/O pins to interface with sensors, peripherals, and external logic while minimizing board-level routing complexity.
• Power  Nominal core supply range of 1.425 V to 1.575 V to match platform power rails and predictable power budgeting.
• Package and Mounting  484-ball FPBGA package (484-FPBGA, 23×23) in a surface-mount format for high-density PCB integration.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation to meet a wide range of industrial environmental requirements.
• Compliance  RoHS compliant for reduced hazardous substances in manufacturing and supply chain compatibility.

Typical Applications

• Industrial Control  Use for programmable logic, machine control interfaces, and I/O aggregation where industrial temperature performance is required.
• Communications Equipment  Implement protocol bridging, custom packet processing, and interface adaptation leveraging the device's logic resources and I/O count.
• Test & Measurement  Deploy in instrumentation for signal conditioning, data capture control, and real-time logic functions backed by on-chip RAM for buffering.
• Embedded Systems  Integrate custom peripherals, glue logic, and control-state machines to reduce external component count and streamline board design.

Unique Advantages

• High logic integration: 24,576 logic elements and ~1,000,000 gates let you consolidate complex digital functions into a single device, reducing BOM and board area.
• Significant I/O capacity: 300 I/O pins support dense peripheral connectivity and flexible interfacing options for mixed-signal and digital systems.
• Embedded memory for local buffering: Approximately 0.147 Mbits of on-chip RAM reduces dependence on external memory for small buffers and FIFOs.
• Industrial-ready operation: Rated from −40 °C to 100 °C to support deployment in harsh or temperature-variable environments.
• Compact BGA package: 484-FPBGA (23×23) surface-mount package enables a high-pin-count solution in a compact footprint for space-constrained PCBs.
• RoHS compliant: Aligns with modern environmental and manufacturing requirements.

Why Choose M7A3P1000-2FGG484I?

The M7A3P1000-2FGG484I positions itself as a robust, industrial-grade FPGA option that balances logic density, I/O capacity, and on-chip memory in a compact 484-BGA package. Its specifications make it well suited for engineers seeking to consolidate custom digital functions and peripheral interfaces into a single, manufacturable device for industrial and embedded applications.

With Microchip Technology's ProASIC3 architecture and explicit support for industrial temperature ranges and RoHS compliance, this device offers a dependable path for designs that require scalability, reduced component count, and long-term supply alignment.

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