OR2C10A3S208I-DB
| Part Description |
ORCA™2 Field Programmable Gate Array (FPGA) IC 171 16384 1024 208-BFQFP |
|---|---|
| Quantity | 590 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-SQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 171 | Voltage | 4.5 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 256 | Number of Logic Elements/Cells | 1024 | ||
| Number of Gates | 28300 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 16384 |
Overview of OR2C10A3S208I-DB – ORCA™2 FPGA IC, 1024 Logic Elements, 171 I/O, 208-BFQFP
The OR2C10A3S208I-DB is an ORCA™2 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for board-level programmable logic. It integrates 1,024 logic elements, 16,384 bits of on-chip RAM and 171 user I/O in a 208-BFQFP (208-SQFP 28×28) surface-mount package.
Built for industrial applications, the device operates from a 4.5 V to 5.5 V supply and is rated for -40 °C to 85 °C, providing a compact, programmable solution where a 5 V I/O domain and industrial temperature range are required.
Key Features
- Logic Resources 1,024 logic elements supporting custom logic implementation and moderate gate counts (listed equivalence: 28,300 gates).
- Embedded Memory 16,384 bits of on-chip RAM for small data buffering, state storage and lookup-tables.
- I/O Capacity 171 user I/O pins to support parallel interfaces and multiple external peripherals at board level.
- Supply Voltage Single-supply operation from 4.5 V to 5.5 V to match 5 V system domains.
- Package & Mounting 208-BFQFP / 208-SQFP (28 × 28) surface-mount package for standard PCB assembly and compact footprints.
- Industrial Temperature Grade Qualified for operation from -40 °C to 85 °C for deployment in industrial environments.
- Standards Compliance RoHS compliant, addressing common environmental and regulatory requirements.
Typical Applications
- Industrial Control Programmable logic for control functions where industrial temperature range and 5 V supply compatibility are required.
- I/O Expansion and Glue Logic High I/O count suited to consolidate interfaces and implement board-level glue logic between peripherals.
- Embedded System Integration Compact FPGA resources and on-chip RAM support moderate embedded logic tasks and customization on 5 V systems.
Unique Advantages
- Balanced Logic and Memory Offers 1,024 logic elements paired with 16,384 bits of RAM for small to medium custom logic implementations.
- High I/O Density 171 I/O pins enable flexible interfacing to multiple peripherals without external I/O expanders.
- 5 V System Compatibility Nominal 4.5 V to 5.5 V supply range simplifies integration into legacy and industrial 5 V designs.
- Industrial Temperature Capability -40 °C to 85 °C rating supports deployment in demanding environmental conditions.
- Compact Surface-Mount Package 208-BFQFP (28×28) provides a standard, manufacturable footprint for PCB-level FPGA integration.
- RoHS Compliant Meets common lead-free and environmental standards for modern electronics manufacturing.
Why Choose OR2C10A3S208I-DB?
The OR2C10A3S208I-DB delivers a compact, industrial-grade programmable logic option with a balance of logic elements, on-chip RAM and a high I/O count in a standard 208-BFQFP package. Its 4.5 V to 5.5 V supply range and -40 °C to 85 °C operating window make it a practical choice for designs that require 5 V compatibility and industrial temperature performance.
This device is well suited to engineers and procurement teams looking for a Lattice Semiconductor ORCA™2 FPGA to implement board-level glue logic, interface consolidation and moderate custom control logic with established environmental and packaging attributes.
Request a quote or submit an inquiry to get pricing and availability for the OR2C10A3S208I-DB. Our team can assist with lead times and volume pricing to support your design and production planning.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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