OR2C10A4J160-DB
| Part Description |
ORCA™2 Field Programmable Gate Array (FPGA) IC 130 16384 1024 160-BQFP |
|---|---|
| Quantity | 21 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 160-QFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 160-BQFP | Number of I/O | 130 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH not applicable | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 256 | Number of Logic Elements/Cells | 1024 | ||
| Number of Gates | 28300 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 16384 |
Overview of OR2C10A4J160-DB – ORCA™2 Field Programmable Gate Array (FPGA) IC 130 16384 1024 160-BQFP
The OR2C10A4J160-DB is an ORCA™2 family field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It integrates programmable logic, on-chip RAM and a substantial I/O count in a compact surface-mount package.
With 1,024 logic elements, 16,384 bits of embedded RAM, 130 I/O and a gate count of 28,300, this device is suited for designs that require modest logic capacity and flexible I/O in a 160-BQFP package while operating from a 4.75 V to 5.25 V supply within commercial temperature ranges.
Key Features
- Core Type The ORCA™2 field programmable gate array architecture provides reprogrammable logic for custom digital functions.
- Logic Capacity 1,024 logic elements available for implementing combinational and sequential logic.
- Embedded Memory 16,384 bits of on-chip RAM for small data buffers, state storage, and control logic.
- I/O 130 general-purpose I/O pins to interface with peripherals, sensors, and external logic.
- Gate Count 28,300 gates indicating the aggregate logic resource available for system functions.
- Power Operates from a 4.75 V to 5.25 V supply for standard 5 V systems.
- Package & Mounting 160-BQFP package, supplier device package listed as 160-QFP (28x28), designed for surface mount assembly.
- Temperature & Grade Commercial grade operation from 0 °C to 70 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- Embedded Control Use where up to 1,024 logic elements and 130 I/O are needed for control state machines, protocol handling, or glue logic.
- I/O Expansion Suitable for designs that require a high count of general-purpose I/O to interface multiple peripherals or sensors.
- Custom Logic Implementation Implement application-specific combinational and sequential logic leveraging 28,300 available gates and on-chip RAM for temporary storage.
Unique Advantages
- Balanced Logic and Memory: Combines 1,024 logic elements with 16,384 bits of embedded RAM to support both control logic and small data buffering in one device.
- High I/O Density: 130 I/O pins provide extensive external connectivity without additional interface chips, helping reduce board complexity.
- Standard Power Compatibility: Designed for a 4.75 V to 5.25 V supply, simplifying integration into legacy 5 V systems.
- Compact Surface-Mount Package: 160-BQFP (supplier 160-QFP 28x28) enables a compact board layout while supporting surface-mount assembly processes.
- Commercial Temperature Rating: Rated for 0 °C to 70 °C operation for mainstream consumer and industrial applications.
- RoHS Compliant: Meets RoHS requirements for environmental and regulatory compatibility.
Why Choose OR2C10A4J160-DB?
OR2C10A4J160-DB offers a practical combination of logic resources, embedded memory and I/O capacity in a single, surface-mount FPGA package from Lattice Semiconductor Corporation. Its specification set — 1,024 logic elements, 16,384 bits of RAM, 130 I/O and 28,300 gates — makes it a fit for designers needing compact, reprogrammable logic for control, interfacing and custom digital functions within commercial temperature ranges.
This device is appropriate for teams and projects that require reliable, reconfigurable logic with straightforward power and packaging constraints, delivering long-term design flexibility and reduced board-level component count.
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