OR2C12A3S208-DBA1357

The OR2C12A3S208-DBA1357 is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for commercial applications. It provides 1,296 logic elements, 20,736 bits of on-chip RAM, and up to 160 general-purpose I/O pins in a 208-pin surface-mount package.

This device is suited for compact digital designs that require configurable logic, embedded memory, and a high pin count in a single, RoHS-compliant package. It operates from a 4.5 V to 5.5 V supply and across a commercial temperature range of 0 °C to 70 °C.

Key Features

• Core Logic  1,296 logic elements provide programmable resources for implementing custom digital functions and glue logic.
• Embedded Memory  20,736 bits of on-chip RAM (approximately 0.0207 Mbits) for data buffering and small lookup tables.
• I/O Capacity  Up to 160 I/O pins support high-pin-count interfacing needs in compact system designs.
• Power  Single-supply operation from 4.5 V to 5.5 V simplifies integration with legacy 5 V systems.
• Package & Mounting  Surface-mount 208-pin package: 208-BFQFP / supplier device package listed as 208-SQFP (28×28), enabling dense PCB layouts.
• Operating Range & Grade  Commercial-grade device rated for 0 °C to 70 °C operation.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing consistency.

Typical Applications

• Custom digital logic and glue circuitry  Use the device’s 1,296 logic elements and 160 I/O pins to implement application-specific control, protocol translation, or interface bridging.
• Embedded memory buffering  Leverage 20,736 bits of on-chip RAM for small data buffers, state storage, and lookup tables in compact designs.
• High-pin-count system integration  The 208-pin surface-mount package supports systems that require many external connections while maintaining a small PCB footprint.

Unique Advantages

• Balanced logic and memory density: 1,296 logic elements combined with 20,736 bits of RAM provide a blend of programmable logic and embedded memory for mid-range digital designs.
• High I/O availability: 160 I/O pins give designers flexibility to connect multiple peripherals and interfaces without adding external I/O expanders.
• Legacy-friendly power range: 4.5 V to 5.5 V supply compatibility makes it straightforward to integrate into existing 5 V systems.
• Compact, surface-mount packaging: 208-pin BFQFP/SQFP package enables dense PCB placement while supporting a substantial number of I/Os.
• Commercial temperature suitability: Rated for 0 °C to 70 °C operation, appropriate for a wide range of commercial electronic products.
• RoHS compliance: Environmentally compliant manufacturing and assembly alignment for regulated markets.

Why Choose OR2C12A3S208-DBA1357?

The OR2C12A3S208-DBA1357 delivers a practical combination of logic resources, embedded memory, and I/O density in a single, commercial-grade FPGA package from Lattice Semiconductor Corporation. Its 1,296 logic elements and 20,736 bits of on-chip RAM make it suitable for compact designs that need configurable digital logic and modest embedded storage.

This device is ideal for engineers and procurement teams building mid-range, commercial electronic systems that require a 208-pin surface-mount FPGA with a 4.5 V–5.5 V supply and RoHS compliance. The balanced feature set supports scalable designs that prioritize integration, I/O accessibility, and straightforward power requirements.

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