OR2C12A4S208-DBA1357

FIELD PROGRAMMABLE GATE ARRAY
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 881 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package208-SQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O160Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceN/AREACH ComplianceREACH not applicable
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs324Number of Logic Elements/Cells1296
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits20736

Overview of OR2C12A4S208-DBA1357 – * Field Programmable Gate Array (FPGA) IC

The OR2C12A4S208-DBA1357 is a field-programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It provides 1,296 logic elements, approximately 20,736 bits of on-chip RAM, and 160 I/O pins in a 208-pin surface-mount package for commercial embedded designs.

With a 4.75 V to 5.25 V supply range, a 0 °C to 70 °C operating temperature window, and RoHS compliance, this device is suited to configurable logic, peripheral interfacing, and mid-density programmable applications where a commercial-grade FPGA is required.

Key Features

  • Core Logic  1,296 logic elements for implementing combinational and sequential logic across midsize designs.
  • Embedded Memory  Approximately 20,736 bits of on-chip RAM to support buffering, small data storage, and local state retention.
  • I/O Capacity  160 I/O pins to support multiple peripheral interfaces and parallel signaling requirements.
  • Power  Single-supply operation from 4.75 V to 5.25 V for integration into standard 5 V systems.
  • Package & Mounting  Surface-mount 208-BFQFP package (supplier device package: 208-SQFP, 28×28) compatible with common PCB assembly workflows.
  • Operating Conditions & Compliance  Commercial temperature range 0 °C to 70 °C and RoHS-compliant for lead-free manufacturing.

Typical Applications

  • Embedded control and glue logic  Implement custom control functions and bus bridging using the device's logic elements and plentiful I/Os.
  • Peripheral interfacing  Support sensor interfaces, display drivers, or parallel peripheral connections with up to 160 I/O pins at 5 V supply levels.
  • Prototyping and development  Use the programmable logic and standard surface-mount package for board-level prototyping in commercial projects.

Unique Advantages

  • Moderate logic density: 1,296 logic elements provide capacity for midsize programmable designs without excessive complexity.
  • High I/O count: 160 I/Os reduce the need for external expanders when interfacing multiple peripherals or parallel devices.
  • On-chip RAM: Approximately 20,736 bits of embedded memory enable local buffering and small data storage without external memory.
  • 5 V system compatibility: 4.75 V to 5.25 V supply range simplifies integration into existing 5 V electronics.
  • Standard packaging: 208-pin BFQFP/SQFP footprint supports routine surface-mount assembly and handling.
  • RoHS-compliant: Conforms to RoHS requirements for lead-free and restricted substance compliance.

Why Choose OR2C12A4S208-DBA1357?

OR2C12A4S208-DBA1357 offers a balanced combination of logic capacity, on-chip memory, and a high I/O count in a 208-pin surface-mount package, making it well suited for commercial embedded designs that require configurable logic and extensive interfacing. Its 5 V supply compatibility and RoHS compliance support integration into established manufacturing processes.

This FPGA is appropriate for designers and teams needing a commercially graded, programmable solution for mid-density logic tasks, prototyping, and I/O-rich applications where the specified resources meet project requirements.

Request a quote or submit a quote to receive pricing and availability information for OR2C12A4S208-DBA1357. Our team can provide lead-time and ordering details to support your project planning.

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