OR2C15A3BA256I-DB
| Part Description |
ORCA™2 Field Programmable Gate Array (FPGA) IC 223 25600 1600 256-BGA |
|---|---|
| Quantity | 1,327 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-PBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 223 | Voltage | 4.5 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 400 | Number of Logic Elements/Cells | 1600 | ||
| Number of Gates | 44200 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 25600 |
Overview of OR2C15A3BA256I-DB – ORCA™2 Field Programmable Gate Array (FPGA) IC 223 25600 1600 256-BGA
The OR2C15A3BA256I-DB is an ORCA™2 Field Programmable Gate Array (FPGA) offered in a 256-BGA package, designed for industrial-grade embedded logic applications. It provides a balance of programmable logic, on-chip RAM and a high I/O count for designs that require flexible digital customization within a robust operating envelope.
Key on-chip resources include 1,600 logic elements, 25,600 bits of RAM, and 223 I/Os. The device supports a 4.5 V to 5.5 V supply range and is rated for operation from -40 °C to 85 °C, making it suitable for many industrial environments.
Key Features
- Core Logic 1,600 logic elements provide the programmable fabric for implementing custom digital functions and control logic.
- Embedded Memory 25,600 bits of on-chip RAM (approximately 0.0256 Mbits) for buffering, state storage, and small-data lookup tables.
- I/O Density 223 general-purpose I/Os to support a wide range of external interfaces and parallel I/O requirements.
- Gate Capacity Approximately 44,200 gates, enabling integration of moderate-complexity digital functions into a single device.
- Power Supports a 4.5 V to 5.5 V supply window to match common industrial power rails.
- Package 256-PBGA (27×27) surface-mount package for compact board-level integration.
- Industrial Temperature Range Rated for operation from -40 °C to 85 °C for deployment in industrial temperature conditions.
- RoHS Compliant Device is compliant with RoHS environmental requirements.
Typical Applications
- Industrial Control Implement custom control logic, state machines and I/O-driven automation tasks that require reliable operation across -40 °C to 85 °C.
- I/O Expansion and Bridging Use the high I/O count for protocol translation, bus bridging or aggregating multiple peripherals in constrained board space.
- Embedded Logic Acceleration Offload specialized digital processing or glue-logic from microcontrollers to dedicated programmable fabric using available logic elements and on-chip RAM.
- Prototyping and Custom IP Rapidly validate and iterate custom digital IP with a compact BGA footprint suitable for development and production builds.
Unique Advantages
- Balanced Logic and Memory: 1,600 logic elements paired with 25,600 bits of RAM enable implementation of moderate-complexity designs with local storage for state and buffering.
- High I/O Count: 223 I/Os minimize external glue logic and simplify board-level integration of multiple interfaces and sensors.
- Industrial Grade: Rated for -40 °C to 85 °C operation and RoHS compliance, supporting deployment in industrial ambient conditions.
- Standard 5 V Power Domain: 4.5 V to 5.5 V supply compatibility aligns with common industrial power rails and legacy systems.
- Compact BGA Package: 256-PBGA (27×27) delivers a small board footprint while maintaining a high pin count for dense designs.
Why Choose OR2C15A3BA256I-DB?
The OR2C15A3BA256I-DB positions itself as a practical, industrial-grade FPGA option where a balance of logic density, on-chip RAM and extensive I/O is required. Its specification set—1,600 logic elements, 25,600 bits of RAM, 223 I/Os, and a 256-PBGA package—makes it suitable for embedded designs that need programmable flexibility without excessive footprint.
This device is well suited to engineers and procurement teams building industrial control, I/O-centric or custom-logic applications that demand reliable operation across a standard industrial temperature range and compatibility with 4.5 V–5.5 V systems.
Request a quote or submit an inquiry for OR2C15A3BA256I-DB to receive pricing, availability and support information tailored to your design needs.

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Headquarters: Hillsboro, Oregon, USA
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