OR2C12A3S208I-DB
| Part Description |
ORCA™2 Field Programmable Gate Array (FPGA) IC 171 20736 1296 208-BFQFP |
|---|---|
| Quantity | 1,060 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-SQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 171 | Voltage | 4.5 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH not applicable | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 324 | Number of Logic Elements/Cells | 1296 | ||
| Number of Gates | 35800 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 20736 |
Overview of OR2C12A3S208I-DB – ORCA™2 FPGA IC, 1296 logic elements, 208-BFQFP
The OR2C12A3S208I-DB is an ORCA™2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a moderate-density programmable logic fabric with integrated memory and a high I/O count, supplied in a 208-pin BFQFP package.
Designed and graded for industrial use, this device is targeted at applications that require configurable logic, substantial I/O, and reliable operation across a -40 °C to 85 °C temperature range.
Key Features
- FPGA Core ORCA™2 Field Programmable Gate Array architecture in a single-chip solution.
- Logic Capacity 1,296 logic elements providing support for moderate-density custom logic implementations (equivalent to approximately 35,800 gates).
- Embedded Memory Approximately 20.7 Kbits of on-chip RAM (20,736 bits) for small data buffering and state storage.
- High I/O Count 171 general-purpose I/O pins to support multiple peripherals, interfaces, and board-level connections.
- Power Supply Single-supply operation from 4.5 V to 5.5 V for compatibility with 5 V logic systems.
- Package & Mounting 208-BFQFP package; supplier device package listed as 208-SQFP (28×28). Surface-mount mounting type for PCB assembly.
- Industrial Temperature Grade Qualified for operation from -40 °C to 85 °C, suitable for industrial environments.
- Regulatory RoHS compliant.
Typical Applications
- Industrial Control Configurable logic and 171 I/O pins make the device suitable for control and monitoring functions in industrial automation equipment.
- Embedded Systems Moderate logic capacity and on-chip RAM support glue logic, protocol bridging, and application-specific processing in embedded designs.
- I/O Expansion and Interface High pin count enables the device to serve as an I/O concentrator or custom interface controller on mixed-signal and digital boards.
Unique Advantages
- Compact Logic Integration: 1,296 logic elements (≈35,800 gates) consolidate custom logic on a single device, reducing external components.
- On-chip Memory for Local Storage: Approximately 20.7 Kbits of embedded RAM supports buffering and small-state storage without external memory.
- Extensive I/O: 171 I/O pins enable flexible connectivity to sensors, peripherals, and other system components.
- 5 V Supply Compatibility: Operates from 4.5 V to 5.5 V, simplifying integration with 5 V legacy and industrial systems.
- Industrial Temperature Range: Rated from -40 °C to 85 °C for reliable operation in industrial environments.
- RoHS Compliant: Meets RoHS requirements for environmentally responsible designs.
Why Choose OR2C12A3S208I-DB?
The OR2C12A3S208I-DB positions itself as a practical choice for engineers needing a moderate-density FPGA with a high I/O count and on-chip memory, packaged for surface-mount PCB assembly. Its industrial temperature rating and 5 V supply range make it suitable for a wide range of industrial and embedded projects that require configurable logic without the complexity of higher-density devices.
Manufactured by Lattice Semiconductor Corporation, this ORCA™2 device offers a balance of integration, I/O capability, and environmental robustness for designs that prioritize reliable, configurable hardware in constrained board spaces.
Request a quote or submit a pricing and availability inquiry to get started with the OR2C12A3S208I-DB for your next design.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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