OR2T08A4BA256-DB
| Part Description |
ORCA™2 Field Programmable Gate Array (FPGA) IC 209 12544 784 256-BGA |
|---|---|
| Quantity | 532 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-PBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 209 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 196 | Number of Logic Elements/Cells | 784 | ||
| Number of Gates | 21600 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12544 |
Overview of OR2T08A4BA256-DB – ORCA™2 Field Programmable Gate Array, 256-BGA
The OR2T08A4BA256-DB is an ORCA™2 field programmable gate array (FPGA) in a compact 256-ball BGA package intended for commercial embedded designs. It provides a balance of programmable logic, on-chip memory and I/O capability—including 784 logic elements, 12,544 bits of embedded RAM and 209 I/O pins—configured for surface-mount assembly.
With a 3.0 V to 3.6 V supply range and a commercial operating temperature of 0 °C to 70 °C, this device suits a wide range of standard commercial applications where moderate logic density and flexible I/O are required.
Key Features
- Core Logic 784 logic elements providing programmable resources capable of implementing moderate-complexity digital functions; equivalent to 21,600 gates reported for the device.
- Embedded Memory 12,544 bits of on-chip RAM for small data buffering, state storage and control tables.
- I/O Capacity 209 general-purpose I/O pins to support multiple external peripherals, interfaces and board-level connections.
- Package and Mounting 256-BGA (supplier package: 256-PBGA, 27×27 mm) in a surface-mount form factor to simplify PCB integration and conserve board area.
- Power Operates from a 3.0 V to 3.6 V supply range suitable for common commercial power rails.
- Operating Temperature Rated for commercial use with an operating range of 0 °C to 70 °C.
- Environmental Compliance RoHS compliant, meeting common lead-free and hazardous substance requirements for commercial electronics.
Typical Applications
- Embedded Control Use in control and glue-logic applications that require up to 784 logic elements and substantial I/O connectivity for peripheral interfacing.
- Prototyping and Development Suitable for board-level prototyping where a compact 256-BGA package and moderate on-chip RAM are needed to validate custom logic.
- Interface Bridge Ideal for designs that need to aggregate or adapt multiple signals, leveraging 209 I/Os to connect sensors, displays or communications modules.
Unique Advantages
- Balanced Logic and Memory: 784 logic elements paired with 12,544 bits of embedded RAM provide a compact programmable solution for control and data path tasks without excessive overcapacity.
- High I/O Count in a Small Package: 209 I/Os in a 256-BGA package enable dense board-level integration while preserving connectivity options.
- Standard Commercial Voltage Range: 3.0 V to 3.6 V operation aligns with common system rails, simplifying power supply design.
- Surface-Mount 256-PBGA Footprint: 27 × 27 mm supplier package supports compact PCB layouts and industry-standard assembly processes.
- RoHS Compliant: Facilitates regulatory alignment for commercial product manufacturing.
Why Choose OR2T08A4BA256-DB?
The OR2T08A4BA256-DB positions itself as a practical FPGA choice for commercial embedded systems that need moderate programmable logic, a meaningful number of I/Os and on-chip RAM in a small BGA footprint. Its electrical and thermal ratings match typical commercial product requirements while offering a compact form factor for space-constrained boards.
This part is well suited to design teams and OEMs implementing control logic, interface bridging or prototype platforms where predictable commercial-grade operation, RoHS compliance and board-level integration are important considerations.
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