OR2T08A5BA256-DB

FPGA, 196 CLBS, 9400 GATES
Part Description

ORCA™2 Field Programmable Gate Array (FPGA) IC 209 12544 784 256-BGA

Quantity 996 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package256-PBGA (27x27)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-BGANumber of I/O209Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Affected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs196Number of Logic Elements/Cells784
Number of Gates21600ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12544

Overview of OR2T08A5BA256-DB – ORCA™2 Field Programmable Gate Array (FPGA), 209 I/O, 256‑BGA

The OR2T08A5BA256-DB is an ORCA™2 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It delivers a compact programmable-logic solution with 196 CLBs and 784 logic elements, along with on-chip RAM and a broad I/O count for flexible system integration.

Designed for commercial applications, this device supports designs that require moderate programmable logic capacity, significant I/O count, and a compact 256‑BGA package while operating from a 3 V to 3.6 V supply and a 0 °C to 70 °C temperature range.

Key Features

  • Core Logic  196 CLBs and 784 logic elements provide the programmable logic resources needed for glue logic, protocol bridging, and control functions.
  • Embedded Memory  12,544 bits of on-chip RAM available for small data buffers and state storage.
  • I/O Capacity  209 I/O pins to support multiple interfaces, peripherals, and parallel connections directly from the FPGA.
  • Gate Count  Approximately 21,600 gates to quantify overall device complexity and integration potential.
  • Power  Single supply operation from 3 V to 3.6 V simplifies power-rail design in commercial systems.
  • Package  256‑BGA (supplier package: 256‑PBGA, 27 × 27 mm) for high pin-count routing in a compact footprint.
  • Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 70 °C.
  • Compliance  RoHS compliant for lead‑free manufacturing requirements.
  • Mounting  Surface mount device for standard PCB assembly processes.

Typical Applications

  • Interface Bridging and I/O Expansion  Use the 209 I/O pins to implement protocol translators, bus bridges, and parallel interface expanders.
  • Embedded Control and Glue Logic  Leverage the 784 logic elements and 12,544 bits of RAM to implement control state machines, custom timing, and peripheral control.
  • Prototyping and Evaluation  Compact package and commercial-grade operation make the device suitable for board-level prototyping and early product validation.
  • Signal Aggregation  Aggregate and preprocess multiple sensor or peripheral signals before passing data to a host processor.

Unique Advantages

  • High I/O Count: 209 I/O pins enable direct connection to many external devices, reducing the need for additional I/O expanders.
  • Balanced Logic and Memory: 196 CLBs, 784 logic elements, and 12,544 bits of RAM allow implementation of a variety of control and buffering functions within a single device.
  • Compact High‑Pin Package: 256‑BGA (27 × 27 mm) provides high routing density in a compact footprint suited to space‑constrained PCBs.
  • Commercial Power Range: 3 V to 3.6 V supply compatibility simplifies integration into standard 3.3 V systems.
  • RoHS Compliant: Meets lead‑free manufacturing requirements for commercial products.

Why Choose OR2T08A5BA256-DB?

The OR2T08A5BA256-DB positions itself as a compact, commercially graded FPGA option with a strong balance of logic elements, embedded RAM, and a high I/O count in a 256‑BGA package. It is well suited for designers who need moderate programmable logic capacity combined with extensive I/O and a small board footprint.

This device is appropriate for teams building commercial electronic products where integration of glue logic, interface functions, and small data buffering into a single, RoHS-compliant FPGA reduces BOM complexity and board space. Its supply and temperature specifications align with standard 3.3 V commercial systems.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the OR2T08A5BA256-DB.

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