OR2T08A5BA256-DB
| Part Description |
ORCA™2 Field Programmable Gate Array (FPGA) IC 209 12544 784 256-BGA |
|---|---|
| Quantity | 996 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-PBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 209 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 196 | Number of Logic Elements/Cells | 784 | ||
| Number of Gates | 21600 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12544 |
Overview of OR2T08A5BA256-DB – ORCA™2 Field Programmable Gate Array (FPGA), 209 I/O, 256‑BGA
The OR2T08A5BA256-DB is an ORCA™2 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It delivers a compact programmable-logic solution with 196 CLBs and 784 logic elements, along with on-chip RAM and a broad I/O count for flexible system integration.
Designed for commercial applications, this device supports designs that require moderate programmable logic capacity, significant I/O count, and a compact 256‑BGA package while operating from a 3 V to 3.6 V supply and a 0 °C to 70 °C temperature range.
Key Features
- Core Logic 196 CLBs and 784 logic elements provide the programmable logic resources needed for glue logic, protocol bridging, and control functions.
- Embedded Memory 12,544 bits of on-chip RAM available for small data buffers and state storage.
- I/O Capacity 209 I/O pins to support multiple interfaces, peripherals, and parallel connections directly from the FPGA.
- Gate Count Approximately 21,600 gates to quantify overall device complexity and integration potential.
- Power Single supply operation from 3 V to 3.6 V simplifies power-rail design in commercial systems.
- Package 256‑BGA (supplier package: 256‑PBGA, 27 × 27 mm) for high pin-count routing in a compact footprint.
- Operating Conditions Commercial temperature grade with an operating range of 0 °C to 70 °C.
- Compliance RoHS compliant for lead‑free manufacturing requirements.
- Mounting Surface mount device for standard PCB assembly processes.
Typical Applications
- Interface Bridging and I/O Expansion Use the 209 I/O pins to implement protocol translators, bus bridges, and parallel interface expanders.
- Embedded Control and Glue Logic Leverage the 784 logic elements and 12,544 bits of RAM to implement control state machines, custom timing, and peripheral control.
- Prototyping and Evaluation Compact package and commercial-grade operation make the device suitable for board-level prototyping and early product validation.
- Signal Aggregation Aggregate and preprocess multiple sensor or peripheral signals before passing data to a host processor.
Unique Advantages
- High I/O Count: 209 I/O pins enable direct connection to many external devices, reducing the need for additional I/O expanders.
- Balanced Logic and Memory: 196 CLBs, 784 logic elements, and 12,544 bits of RAM allow implementation of a variety of control and buffering functions within a single device.
- Compact High‑Pin Package: 256‑BGA (27 × 27 mm) provides high routing density in a compact footprint suited to space‑constrained PCBs.
- Commercial Power Range: 3 V to 3.6 V supply compatibility simplifies integration into standard 3.3 V systems.
- RoHS Compliant: Meets lead‑free manufacturing requirements for commercial products.
Why Choose OR2T08A5BA256-DB?
The OR2T08A5BA256-DB positions itself as a compact, commercially graded FPGA option with a strong balance of logic elements, embedded RAM, and a high I/O count in a 256‑BGA package. It is well suited for designers who need moderate programmable logic capacity combined with extensive I/O and a small board footprint.
This device is appropriate for teams building commercial electronic products where integration of glue logic, interface functions, and small data buffering into a single, RoHS-compliant FPGA reduces BOM complexity and board space. Its supply and temperature specifications align with standard 3.3 V commercial systems.
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