OR2T15B8BA256-DB
| Part Description |
ORCA™2 Field Programmable Gate Array (FPGA) IC 211 25600 1600 256-BGA |
|---|---|
| Quantity | 1,185 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-PBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 211 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 400 | Number of Logic Elements/Cells | 1600 | ||
| Number of Gates | 44200 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 25600 |
Overview of OR2T15B8BA256-DB – ORCA™2 FPGA, 1,600 Logic Elements, 211 I/Os, 256-BGA
The OR2T15B8BA256-DB is an ORCA™2 field programmable gate array (FPGA) IC designed for compact, commercial-grade programmable-logic implementations. It delivers 1,600 logic elements, approximately 25,600 bits of embedded RAM, and up to 211 user I/Os in a 256-ball BGA package, making it suitable for board-level designs that require moderate logic density, flexible I/O, and on-chip memory.
With a 3.0–3.6 V supply range and commercial operating temperature of 0 °C to 70 °C, this device targets general embedded applications where space efficiency, RoHS compliance, and surface-mount packaging are important considerations.
Key Features
- Core Logic 1,600 logic elements providing programmable resources for custom digital functions and control logic.
- On-chip Memory Approximately 25,600 bits of embedded RAM for small data buffers, FIFOs, and state storage.
- I/O Capacity 211 user I/Os to support multiple peripheral interfaces and board-level signal routing.
- Gate Count 44,200 gates for estimating relative design complexity and resource usage.
- Power Operates from a 3.0 V to 3.6 V supply, compatible with common 3 V power domains.
- Package & Mounting 256-ball BGA (256-PBGA, 27 × 27 mm) surface-mount package for compact PCB integration.
- Grade & Temperature Range Commercial grade with an operating range of 0 °C to 70 °C.
- Environmental Compliance RoHS compliant for regulatory and manufacturing compatibility.
Typical Applications
- Embedded control and glue logic Implement control state machines, protocol bridging, and board-level glue logic using the device’s 1,600 logic elements and abundant I/Os.
- I/O consolidation and interface adaptation Use the 211 I/Os to gather, buffer, or re-map signals between multiple peripherals and system controllers.
- Small-data buffering and FIFOs Leverage approximately 25,600 bits of embedded RAM for temporary data storage, buffering, and simple queueing functions.
- Compact PCB designs The 256-ball BGA package supports high-density board layouts where area and routing are constrained.
Unique Advantages
- Balanced logic and memory mix: 1,600 logic elements paired with ~25.6kbits of RAM support moderate-complexity designs that require both logic and embedded storage.
- High I/O count: 211 user I/Os enable consolidation of multiple interfaces and reduce the need for external I/O expanders.
- Compact packaging: 256-PBGA (27 × 27 mm) provides a space-efficient footprint for denser PCB implementations.
- Simple power requirements: 3.0–3.6 V supply aligns with common system rails for straightforward power design.
- RoHS compliant: Meets lead-free manufacturing requirements for modern assembly processes.
- Commercial-grade suitability: Specified operating range of 0 °C to 70 °C for standard consumer and commercial applications.
Why Choose OR2T15B8BA256-DB?
The OR2T15B8BA256-DB positions itself as a compact, RoHS-compliant FPGA solution for designers requiring a moderate amount of programmable logic, significant I/O density, and on-chip RAM in a space-efficient BGA package. Its electrical and thermal specifications make it appropriate for commercial embedded systems, interface bridging, and board-level logic integration where reliability and a predictable supply voltage are important.
Engineers and procurement teams seeking a balanced FPGA for prototyping or production-level designs will benefit from the device’s combination of logic resources, I/O capacity, and compact package, which together help reduce external components and simplify PCB layouts.
Request a quote or submit an inquiry to receive pricing and availability for the OR2T15B8BA256-DB.