OR2T15B8BA256-DB

FPGA, 400 CLBS, 19200 GATES
Part Description

ORCA™2 Field Programmable Gate Array (FPGA) IC 211 25600 1600 256-BGA

Quantity 1,185 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package256-PBGA (27x27)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-BGANumber of I/O211Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Affected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs400Number of Logic Elements/Cells1600
Number of Gates44200ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits25600

Overview of OR2T15B8BA256-DB – ORCA™2 FPGA, 1,600 Logic Elements, 211 I/Os, 256-BGA

The OR2T15B8BA256-DB is an ORCA™2 field programmable gate array (FPGA) IC designed for compact, commercial-grade programmable-logic implementations. It delivers 1,600 logic elements, approximately 25,600 bits of embedded RAM, and up to 211 user I/Os in a 256-ball BGA package, making it suitable for board-level designs that require moderate logic density, flexible I/O, and on-chip memory.

With a 3.0–3.6 V supply range and commercial operating temperature of 0 °C to 70 °C, this device targets general embedded applications where space efficiency, RoHS compliance, and surface-mount packaging are important considerations.

Key Features

  • Core Logic 1,600 logic elements providing programmable resources for custom digital functions and control logic.
  • On-chip Memory Approximately 25,600 bits of embedded RAM for small data buffers, FIFOs, and state storage.
  • I/O Capacity 211 user I/Os to support multiple peripheral interfaces and board-level signal routing.
  • Gate Count 44,200 gates for estimating relative design complexity and resource usage.
  • Power Operates from a 3.0 V to 3.6 V supply, compatible with common 3 V power domains.
  • Package & Mounting 256-ball BGA (256-PBGA, 27 × 27 mm) surface-mount package for compact PCB integration.
  • Grade & Temperature Range Commercial grade with an operating range of 0 °C to 70 °C.
  • Environmental Compliance RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

  • Embedded control and glue logic Implement control state machines, protocol bridging, and board-level glue logic using the device’s 1,600 logic elements and abundant I/Os.
  • I/O consolidation and interface adaptation Use the 211 I/Os to gather, buffer, or re-map signals between multiple peripherals and system controllers.
  • Small-data buffering and FIFOs Leverage approximately 25,600 bits of embedded RAM for temporary data storage, buffering, and simple queueing functions.
  • Compact PCB designs The 256-ball BGA package supports high-density board layouts where area and routing are constrained.

Unique Advantages

  • Balanced logic and memory mix: 1,600 logic elements paired with ~25.6kbits of RAM support moderate-complexity designs that require both logic and embedded storage.
  • High I/O count: 211 user I/Os enable consolidation of multiple interfaces and reduce the need for external I/O expanders.
  • Compact packaging: 256-PBGA (27 × 27 mm) provides a space-efficient footprint for denser PCB implementations.
  • Simple power requirements: 3.0–3.6 V supply aligns with common system rails for straightforward power design.
  • RoHS compliant: Meets lead-free manufacturing requirements for modern assembly processes.
  • Commercial-grade suitability: Specified operating range of 0 °C to 70 °C for standard consumer and commercial applications.

Why Choose OR2T15B8BA256-DB?

The OR2T15B8BA256-DB positions itself as a compact, RoHS-compliant FPGA solution for designers requiring a moderate amount of programmable logic, significant I/O density, and on-chip RAM in a space-efficient BGA package. Its electrical and thermal specifications make it appropriate for commercial embedded systems, interface bridging, and board-level logic integration where reliability and a predictable supply voltage are important.

Engineers and procurement teams seeking a balanced FPGA for prototyping or production-level designs will benefit from the device’s combination of logic resources, I/O capacity, and compact package, which together help reduce external components and simplify PCB layouts.

Request a quote or submit an inquiry to receive pricing and availability for the OR2T15B8BA256-DB.

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