OR2T15B7BA256I-DB

The OR2T15B7BA256I-DB is an ORCA™2 field programmable gate array (FPGA) IC providing a balance of logic capacity, on-chip memory, and high I/O density in a compact ball grid array package. With 1,600 logic elements, 25,600 bits of embedded RAM and 211 I/Os, it is suited for designs that require moderate logic integration with a large number of external interfaces.

Designed for industrial operation, the device supports a 3.0 V to 3.6 V supply range, a surface-mount 256-BGA (27×27) package, and an operating temperature range of −40 °C to 85 °C, enabling reliable operation across typical industrial environments.

Key Features

• Logic Capacity 1,600 logic elements provide on-chip programmable logic suitable for control, glue-logic and mid-density integration tasks.
• Embedded Memory 25,600 bits of on-chip RAM for register files, small buffers, and state storage without external memory.
• I/O Density 211 general-purpose I/Os to support a broad range of peripheral interfaces and external signals.
• Gate Count Approximately 44,200 gates indicating overall device complexity and integration potential.
• Power Nominal supply operation from 3.0 V to 3.6 V to match common single-supply system rails.
• Package & Mounting 256-ball BGA (256-PBGA 27×27) in a surface-mount package for compact board-level integration.
• Temperature & Grade Industrial grade device with an operating temperature range of −40 °C to 85 °C for deployment in demanding environments.
• Regulatory RoHS compliant, supporting lead-free assembly and regulatory requirements for many markets.

Typical Applications

• Industrial Control Use the FPGA for control logic, signal multiplexing and interface handling in industrial equipment operating across −40 °C to 85 °C.
• Interface Aggregation High I/O count enables consolidation of multiple peripheral interfaces and custom I/O routing on a single device.
• Embedded Logic Integration Implement glue logic, state machines and moderate-density custom processing with 1,600 logic elements and on-chip RAM.
• Compact Board Designs The 256-BGA package allows high integration in space-constrained applications while maintaining a broad I/O set.

Unique Advantages

• High I/O Count: 211 I/Os reduce the need for external expanders and simplify board-level connectivity.
• Balanced Logic and Memory: Combined 1,600 logic elements and 25,600 bits of RAM enable efficient implementation of control and buffering functions on-chip.
• Industrial Temperature Range: Rated from −40 °C to 85 °C for reliable operation across common industrial ambient conditions.
• Compact BGA Footprint: 256-BGA (27×27) package saves PCB area while supporting dense pinout requirements.
• Flexible Supply Range: 3.0 V to 3.6 V operation aligns with standard system rails, easing power-supply design.
• RoHS Compliant: Supports lead-free manufacturing and environmental compliance needs.

Why Choose OR2T15B7BA256I-DB?

The OR2T15B7BA256I-DB positions itself as a mid-density, industrial-grade FPGA option that combines a useful mix of logic elements, on-chip RAM and one of the higher I/O counts in a compact 256-BGA package. It is well suited to engineers and procurement teams looking for a programmable device that simplifies board-level interface consolidation and embedded control functions while meeting industrial temperature and RoHS requirements.

Its combination of 1,600 logic elements, 25,600 bits of on-chip RAM, 211 I/Os, and a 3.0 V–3.6 V supply range offers a practical platform for designs that require moderate programmable logic capacity and extensive external connectivity without excessive board area.

Request a quote or submit an inquiry to obtain pricing, availability and further ordering information for OR2T15B7BA256I-DB.