OR2T40A6BA352I-DB

The OR2T40A6BA352I-DB is an ORCA™2 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a compact, surface-mount FPGA footprint with 3,600 logic elements and approximately 57.6kbits of embedded RAM for implementing custom digital logic in space-constrained designs.

With 286 I/O pins, a gate-equivalent count of 99,400, industrial-grade temperature range, and a 3.0–3.6 V supply window, this device targets embedded and industrial applications that require significant I/O density and on-chip memory within a 352-BBGA package.

Key Features

• Core Logic — 3,600 logic elements suitable for implementing custom state machines, glue logic, and moderate-complexity digital functions.
• On‑Chip Memory — Approximately 57.6kbits of embedded RAM to support buffering, FIFOs, and small data stores without external memory.
• I/O Density — 286 user I/O pins to support multiple peripherals, buses, and high-pin-count interfaces directly on-chip.
• Gate Capacity — 99,400 equivalent gates for consolidated integration of multiple functions into a single FPGA device.
• Power — Operates from a 3.0 V to 3.6 V supply range to match common system power rails.
• Package & Mounting — Surface-mount 352‑BBGA package (supplier device package: 352‑PBGA, 35×35) for board-level integration in compact assemblies.
• Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 85 °C for deployment in temperature-sensitive environments.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control — Use the industrial temperature rating, high I/O count, and on-chip logic to implement sensor interfaces, I/O aggregation, and control logic for machinery and factory automation.
• Embedded Systems — Integrate custom peripheral controllers, protocol bridges, and timing-critical glue logic in compact embedded products using the device’s logic and RAM resources.
• Communications Equipment — Leverage plentiful I/O and gate capacity to handle parallel interfaces, custom packet processing, or protocol conversion tasks.
• Prototyping and Custom Logic — Implement and iterate custom digital designs where moderate logic density and on-chip RAM are required without adding external components.

Unique Advantages

• Balanced Logic and Memory: 3,600 logic elements combined with approximately 57.6kbits of embedded RAM let designers implement both control logic and local buffering on a single device, reducing external components.
• High I/O Capacity: 286 I/O pins permit direct connection to multiple peripherals and buses, simplifying board-level signal routing and integration.
• Industrial-Rated Operation: Specified for −40 °C to 85 °C operation, enabling deployment in demanding temperature environments common to industrial applications.
• Compact BGA Package: 352‑BBGA (35×35) surface-mount package provides high pin density in a compact footprint for space-constrained designs.
• Standard Supply Voltage: 3.0–3.6 V supply compatibility with common system power rails eases power system design.
• RoHS Compliant: Meets RoHS requirements for regulated material content.

Why Choose OR2T40A6BA352I-DB?

The OR2T40A6BA352I-DB positions itself as a practical FPGA option for designers needing a combination of moderate logic density, on-chip memory, and high I/O capacity in an industrial-rated, surface-mount package. Its specs align with embedded and industrial projects that require consolidated digital functions without a large external component count.

This device is appropriate for engineers and procurement teams looking for a compact FPGA solution that balances gate count, memory, and I/O while operating on standard 3.0–3.6 V rails and across an industrial temperature range, helping to simplify BOM and board design.

Request a quote or submit a purchasing inquiry to obtain pricing, availability, and lead-time information for the OR2T40A6BA352I-DB.