OR2T40A6PS208I-DB
| Part Description |
ORCA™2 Field Programmable Gate Array (FPGA) IC 163 57600 3600 208-BFQFP Exposed Pad |
|---|---|
| Quantity | 714 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-SQFP2 (28x28) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP Exposed Pad | Number of I/O | 163 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH not applicable | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 900 | Number of Logic Elements/Cells | 3600 | ||
| Number of Gates | 99400 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 57600 |
Overview of OR2T40A6PS208I-DB – ORCA™2 FPGA, 3600 logic elements, 163 I/O, 208-BFQFP Exposed Pad
The OR2T40A6PS208I-DB is an ORCA™2 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a compact, industrial-grade reconfigurable logic solution optimized for board-level integration with a 208-BFQFP exposed pad package and surface-mount assembly.
With 3,600 logic elements, approximately 0.058 Mbits of embedded memory, and 163 general-purpose I/O pins, this device targets industrial embedded designs that require flexible logic implementation, moderate on-chip memory, and broad I/O connectivity within a small package footprint.
Key Features
- Core Logic 3600 logic elements (cells) providing programmable combinational and sequential resources for custom logic functions.
- Embedded Memory Approximately 0.058 Mbits of on-chip RAM (57,600 bits) for buffering, state storage, and small lookup-table requirements.
- I/O Capacity 163 I/O pins to support a wide range of board-level interfaces and peripheral connections.
- Gate Equivalent Approximately 99,400 gates for estimating integration density and partitioning across system functions.
- Power Operates from a 3 V to 3.6 V supply range suitable for common embedded power rails.
- Package & Mounting 208-BFQFP exposed pad (supplier package: 208-SQFP2, 28 × 28) in a surface-mount form factor for compact PCB layouts and thermal conduction through the exposed pad.
- Temperature Grade Industrial operating range from −40°C to 85°C for deployment in commercial and industrial environments.
- Regulatory RoHS compliant.
Typical Applications
- Industrial Control Use as configurable logic for control sequencing, I/O aggregation, and signal conditioning in industrial equipment that requires industrial temperature operation.
- Embedded Interface Glue Implement custom protocol adaptation and peripheral interfacing on compact PCBs using the device’s 163 I/O pins.
- Custom Peripheral Integration Deploy for small to moderate complexity peripheral and timing functions where 3,600 logic elements and embedded RAM provide adequate on-chip resources.
Unique Advantages
- Balanced integration density: 3600 logic elements and ~0.058 Mbits of RAM offer a practical mix of logic and memory for mid-range embedded tasks.
- High I/O count in a compact package: 163 I/O pins in a 208-BFQFP exposed pad package enable extensive board-level interfacing without a large footprint.
- Industrial temperature capability: −40°C to 85°C rating supports deployment in a wide range of commercial and industrial environments.
- Standard low-voltage supply: 3 V to 3.6 V operation aligns with common embedded power rails for simplified power design.
- Surface-mount BFQFP with exposed pad: Facilitates thermal dissipation and compact PCB assembly while maintaining manufacturability.
- RoHS compliant: Meets common material and environmental requirements for modern electronics manufacturing.
Why Choose OR2T40A6PS208I-DB?
The OR2T40A6PS208I-DB positions itself as a practical, industrial-grade FPGA option for designers needing mid-level logic capacity, substantial I/O, and compact package integration. Its combination of 3,600 logic elements, 163 I/O pins, and a 208-BFQFP exposed pad package makes it suitable for embedded systems where board-level interfacing and moderate on-chip memory are primary concerns.
Choose this ORCA™2 device for projects that demand reliable operation across −40°C to 85°C, compatibility with a 3–3.6 V supply, and a surface-mount form factor that supports manageable thermal routing and assembly. It offers a focused balance of integration, connectivity, and industrial readiness for long-term, scalable embedded designs.
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