OR2T40A6PS208I-DB

FPGA, 900 CLBS, 43200 GATES
Part Description

ORCA™2 Field Programmable Gate Array (FPGA) IC 163 57600 3600 208-BFQFP Exposed Pad

Quantity 714 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package208-SQFP2 (28x28)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case208-BFQFP Exposed PadNumber of I/O163Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH not applicable
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs900Number of Logic Elements/Cells3600
Number of Gates99400ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits57600

Overview of OR2T40A6PS208I-DB – ORCA™2 FPGA, 3600 logic elements, 163 I/O, 208-BFQFP Exposed Pad

The OR2T40A6PS208I-DB is an ORCA™2 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a compact, industrial-grade reconfigurable logic solution optimized for board-level integration with a 208-BFQFP exposed pad package and surface-mount assembly.

With 3,600 logic elements, approximately 0.058 Mbits of embedded memory, and 163 general-purpose I/O pins, this device targets industrial embedded designs that require flexible logic implementation, moderate on-chip memory, and broad I/O connectivity within a small package footprint.

Key Features

  • Core Logic  3600 logic elements (cells) providing programmable combinational and sequential resources for custom logic functions.
  • Embedded Memory  Approximately 0.058 Mbits of on-chip RAM (57,600 bits) for buffering, state storage, and small lookup-table requirements.
  • I/O Capacity  163 I/O pins to support a wide range of board-level interfaces and peripheral connections.
  • Gate Equivalent  Approximately 99,400 gates for estimating integration density and partitioning across system functions.
  • Power  Operates from a 3 V to 3.6 V supply range suitable for common embedded power rails.
  • Package & Mounting  208-BFQFP exposed pad (supplier package: 208-SQFP2, 28 × 28) in a surface-mount form factor for compact PCB layouts and thermal conduction through the exposed pad.
  • Temperature Grade  Industrial operating range from −40°C to 85°C for deployment in commercial and industrial environments.
  • Regulatory  RoHS compliant.

Typical Applications

  • Industrial Control  Use as configurable logic for control sequencing, I/O aggregation, and signal conditioning in industrial equipment that requires industrial temperature operation.
  • Embedded Interface Glue  Implement custom protocol adaptation and peripheral interfacing on compact PCBs using the device’s 163 I/O pins.
  • Custom Peripheral Integration  Deploy for small to moderate complexity peripheral and timing functions where 3,600 logic elements and embedded RAM provide adequate on-chip resources.

Unique Advantages

  • Balanced integration density: 3600 logic elements and ~0.058 Mbits of RAM offer a practical mix of logic and memory for mid-range embedded tasks.
  • High I/O count in a compact package: 163 I/O pins in a 208-BFQFP exposed pad package enable extensive board-level interfacing without a large footprint.
  • Industrial temperature capability: −40°C to 85°C rating supports deployment in a wide range of commercial and industrial environments.
  • Standard low-voltage supply: 3 V to 3.6 V operation aligns with common embedded power rails for simplified power design.
  • Surface-mount BFQFP with exposed pad: Facilitates thermal dissipation and compact PCB assembly while maintaining manufacturability.
  • RoHS compliant: Meets common material and environmental requirements for modern electronics manufacturing.

Why Choose OR2T40A6PS208I-DB?

The OR2T40A6PS208I-DB positions itself as a practical, industrial-grade FPGA option for designers needing mid-level logic capacity, substantial I/O, and compact package integration. Its combination of 3,600 logic elements, 163 I/O pins, and a 208-BFQFP exposed pad package makes it suitable for embedded systems where board-level interfacing and moderate on-chip memory are primary concerns.

Choose this ORCA™2 device for projects that demand reliable operation across −40°C to 85°C, compatibility with a 3–3.6 V supply, and a surface-mount form factor that supports manageable thermal routing and assembly. It offers a focused balance of integration, connectivity, and industrial readiness for long-term, scalable embedded designs.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical support for the OR2T40A6PS208I-DB.

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