OR2T40A7BC432-DB
| Part Description |
ORCA™2 Field Programmable Gate Array (FPGA) IC 326 57600 3600 432-LBGA Exposed Pad |
|---|---|
| Quantity | 271 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 432-EBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 432-LBGA Exposed Pad | Number of I/O | 326 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 1 (Unlimited) | Number of LABs/CLBs | 900 | Number of Logic Elements/Cells | 3600 | ||
| Number of Gates | 99400 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 57600 |
Overview of OR2T40A7BC432-DB – ORCA™2 Field Programmable Gate Array (FPGA) IC
The OR2T40A7BC432-DB is an ORCA™2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It delivers a balanced combination of programmable logic, on-chip memory, and a high pin-count package suitable for commercial embedded designs that require flexible digital logic and extensive I/O connectivity.
Key attributes include 3,600 logic elements, approximately 0.058 Mbits of embedded memory, and 326 user I/O pins in a 432-LBGA exposed pad package. The device is RoHS compliant and rated for commercial temperature operation.
Key Features
- Core & Logic
3600 logic elements provide the programmable fabric for implementing custom digital functions and moderate-density logic designs. - Embedded Memory
Approximately 0.058 Mbits (57,600 bits) of on-chip RAM for data buffering, state storage, and small FIFOs. - I/O & Connectivity
326 user I/O pins support broad peripheral interfacing and signal routing in high-pin-count applications. - Package & Mounting
432-LBGA exposed pad (supplier package: 432-EBGA 40×40) in a surface-mount form factor for compact board layouts and improved thermal coupling to the PCB. - Power
Operates from a 3.0 V to 3.6 V supply range to match common system rails. - Temperature & Grade
Commercial grade operation from 0 °C to 70 °C for standard commercial-environment deployments. - Regulatory
RoHS compliant. - Design Density
Approximately 99,400 gates suitable for mid-density programmable logic implementations.
Typical Applications
- Commercial Embedded Systems — Use the FPGA’s 3,600 logic elements and on-chip RAM for control functions, custom state machines, and peripheral management in commercial products.
- High-Connectivity Interfaces — With 326 I/O pins, the device enables extensive sensor, bus, and peripheral interfacing for systems requiring many external signals.
- Prototyping and Development — The exposed pad 432-LBGA package and commercial-grade rating make this device suitable for board-level prototypes and functional validation in commercial environments.
Unique Advantages
- High I/O Count in a Compact Package: 326 user I/Os in a 432-LBGA exposed pad package maximize connectivity while conserving board area.
- Balanced Logic and Memory: 3,600 logic elements paired with approximately 0.058 Mbits of embedded RAM support a range of mid-density logic functions and local buffering needs.
- Commercial-Grade Availability: Rated for 0 °C to 70 °C and RoHS compliant, the device fits standard commercial product lifecycles and environmental expectations.
- Flexible Powering: 3.0 V to 3.6 V supply compatibility eases integration with common system power rails.
- Surface-Mount Exposed Pad Package: The exposed pad 432-LBGA supports compact PCB layouts and provides a path for board-level thermal dissipation.
Why Choose OR2T40A7BC432-DB?
The OR2T40A7BC432-DB positions itself as a mid-density, highly connected FPGA solution for commercial applications. It combines 3,600 logic elements, a substantial I/O count, and on-chip RAM within a compact 432-LBGA exposed pad package, making it a pragmatic choice for designers seeking programmable logic with extensive external interfacing.
Backed by Lattice Semiconductor Corporation’s ORCA™2 family, this device offers an integration point for commercial embedded designs where board area, I/O density, and standard commercial-temperature operation are primary considerations.
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