OR2T40A7PS240-DB
| Part Description |
ORCA™2 Field Programmable Gate Array (FPGA) IC 184 57600 3600 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 1,249 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 240-SQFP2 (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 184 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 900 | Number of Logic Elements/Cells | 3600 | ||
| Number of Gates | 99400 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 57600 |
Overview of OR2T40A7PS240-DB – ORCA™2 Field Programmable Gate Array (FPGA) IC 184 I/O 57600-bit RAM 3600 Logic Elements 240-BFQFP Exposed Pad
The OR2T40A7PS240-DB is an ORCA™2 field programmable gate array (FPGA) supplied in a 240-BFQFP exposed-pad surface-mount package. It provides 3,600 logic elements, approximately 0.058 Mbits (57,600 bits) of on‑chip RAM and up to 184 I/O pins, making it suitable for compact commercial embedded logic designs. Designed for 3.0 V to 3.6 V supplies and commercial operating temperatures (0 °C to 70 °C), it targets applications that require flexible, reprogrammable logic in a space-efficient package.
Key Features
- Logic Capacity 3,600 logic elements and 90 LABs provide programmable logic resources for implementing custom digital functions and glue logic.
- Embedded Memory Approximately 0.058 Mbits (57,600 bits) of on‑chip RAM to support small FIFOs, lookup tables and register storage.
- I/O Up to 184 I/O pins enable multiple peripheral interfaces and board-level signal routing within a single device footprint.
- Device Density (Gates) Approximately 99,400 gates to characterize overall usable capacity for logic synthesis and implementation.
- Power and Voltage Single-supply operation from 3.0 V to 3.6 V to match common system power rails.
- Package and Mounting 240-BFQFP exposed pad (supplier device package: 240-SQFP2 32×32) surface-mount package for thermal conduction and compact PCB integration.
- Commercial Grade & Environmental Commercial operating temperature range of 0 °C to 70 °C and RoHS compliance for regulatory alignment.
Typical Applications
- Embedded control logic — Implement custom finite-state machines, command sequencing and board-level glue logic where reconfigurability is required.
- Interface bridging — Consolidate multiple digital interfaces and manage signal routing between subsystems using the available I/O.
- Sensor aggregation and preprocessing — Collect and precondition multiple sensor inputs with on‑chip logic and memory buffers.
- User interface control — Drive and manage control panels, indicators and peripheral interfaces in compact commercial products.
Unique Advantages
- Compact programmable logic: 3,600 logic elements and roughly 99,400 gates enable meaningful logic integration in a single device to reduce component count.
- Generous I/O count: 184 I/O pins support multiple peripherals and interfaces without external I/O expanders, simplifying board design.
- Embedded memory for buffering: Approximately 57,600 bits of RAM allow local data storage for FIFOs, small buffers and lookup tables, reducing dependence on external memory.
- Standard commercial operating range: Specified for 0 °C to 70 °C to align with a wide range of commercial product requirements.
- Surface-mount exposed-pad package: 240-BFQFP with exposed pad and 32×32 supplier footprint supports compact PCB layouts and thermal management.
- RoHS compliant: Conforms to RoHS environmental requirements for lead-free manufacturing processes.
Why Choose OR2T40A7PS240-DB?
The OR2T40A7PS240-DB balances a practical logic capacity with a high I/O count in a space-conscious 240-BFQFP exposed-pad package, making it well suited for commercial embedded designs that need reprogrammable logic, interface consolidation and on‑chip buffering. Its 3.0–3.6 V supply range and commercial temperature rating align with typical board-level power and environmental conditions.
For teams building compact control, interface or preprocessing functions, this FPGA provides an integrated, reconfigurable platform that can reduce BOM complexity while maintaining design flexibility and RoHS compliance.
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Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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