OR2T40B7BC432-DB
| Part Description |
ORCA™2 Field Programmable Gate Array (FPGA) IC 342 57600 3600 432-LBGA Exposed Pad |
|---|---|
| Quantity | 824 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 432-EBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 432-LBGA Exposed Pad | Number of I/O | 342 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 900 | Number of Logic Elements/Cells | 3600 | ||
| Number of Gates | 99400 | ECCN | 3A001A7C | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 57600 |
Overview of OR2T40B7BC432-DB – ORCA™2 Field Programmable Gate Array (FPGA) IC
The OR2T40B7BC432-DB is an ORCA™2 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation providing mid-range programmable logic capacity in a compact BGA package. It integrates 3,600 logic elements, approximately 57,600 bits of on-chip RAM and up to 342 general-purpose I/O, making it suitable for commercial embedded designs that require significant I/O density and on-chip memory.
Designed for surface-mount assembly, this device operates from a 3.0 V to 3.6 V supply and is specified for commercial temperature operation from 0 °C to 70 °C. The device is RoHS compliant and packaged in a 432-ball LBGA with exposed pad (supplier package listed as 432-EBGA, 40×40).
Key Features
- Logic Capacity — 3,600 logic elements and approximately 99,400 gates provide the core programmable resources for implementing custom logic functions.
- Embedded Memory — 57,600 bits of total on-chip RAM enable local data buffering and state storage for finite-state machines and small-data applications.
- I/O Density — Up to 342 I/O pins support rich connectivity for sensor interfaces, peripherals, and parallel/serial I/O expansion.
- Power — Operates from a 3.0 V to 3.6 V supply range to match common commercial logic supply rails.
- Package and Mounting — 432-LBGA exposed pad package (supplier device package: 432-EBGA, 40×40) with surface-mount mounting type for compact board integration.
- Operating Range and Grade — Commercial grade device specified for 0 °C to 70 °C operation.
- Compliance — RoHS compliant, supporting regulatory and environmental requirements for commercial electronic products.
Typical Applications
- Commercial embedded systems — Implement custom control logic, glue-logic and interface functions in space-constrained, commercial-grade products.
- I/O bridging and aggregation — Concentrate multiple peripheral interfaces into a single programmable device using the high I/O count.
- Prototyping and proof-of-concept — Validate hardware partitioning and custom logic with a mid-range FPGA resource set and on-chip RAM.
- User interface and peripheral control — Manage display, input, and local peripheral timing and control in compact assemblies.
Unique Advantages
- High I/O count: 342 I/O pins enable dense connectivity without external multiplexing, simplifying board-level design.
- Balanced logic and memory: 3,600 logic elements combined with 57,600 bits of RAM support a wide range of mid-level logic and buffering tasks on-chip.
- Compact BGA packaging: 432-LBGA exposed pad (432-EBGA, 40×40) offers a small footprint for space-constrained PCBs while providing thermal pad support.
- Commercial operating range: Rated for 0 °C to 70 °C operation to match commercial product requirements.
- RoHS compliant: Meets environmental compliance expectations for modern electronics manufacturing.
- Standard supply voltage: 3.0 V to 3.6 V operation aligns with common commercial logic rails for straightforward power design.
Why Choose OR2T40B7BC432-DB?
The OR2T40B7BC432-DB positions itself as a practical, mid-range FPGA solution for commercial applications that need substantial I/O capacity and on-chip memory in a compact BGA package. Its combination of 3,600 logic elements, approximately 57,600 bits of RAM and 342 I/O pins enables consolidation of glue logic, interface bridging and moderate custom logic into a single device.
Backed by Lattice Semiconductor Corporation as the manufacturer and delivered in a 432-ball BGA with exposed pad, this device is aimed at designers seeking a balance of integration, board space efficiency and standard commercial operating specifications for volume production and prototype development.
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