OR3C804BA352I-DB

The OR3C804BA352I-DB is an ORCA™3C field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation supplied in a 352-BBGA (352-PBGA, 35×35) package. It provides a mid-range configurable-logic resource set with a high I/O count and on-chip RAM targeted at industrial applications.

With 3,872 logic elements, 63,488 bits of embedded RAM, and up to 298 I/O, this device is designed for designs that require flexible logic implementation, significant I/O density, and operation across an industrial temperature range.

Key Features

• Logic Capacity — 3,872 logic elements available for implementing custom logic, state machines, and glue logic.
• Embedded Memory — 63,488 total RAM bits (approximately 63 kbits) of on-chip memory for buffering, small lookup tables, and local data storage.
• I/O Density — Up to 298 I/O pins to support wide peripheral interfacing, parallel buses, and high pin-count designs.
• Gate Count — 116,000 gates providing the underlying gate-equivalent capacity for synthesized logic.
• Supply Voltage — Operates from 4 V to 6 V, allowing compatibility with systems using higher single-supply rails.
• Package & Mounting — 352-BBGA (352-PBGA, 35×35) surface-mount package for compact PCB integration.
• Temperature Range — Industrial operating range from −40 °C to 85 °C for deployment in demanding environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement custom control logic, I/O aggregation, and interface translation within industrial systems operating across −40 °C to 85 °C.
• I/O Expansion and Glue Logic — Use the high I/O count to consolidate peripheral interfaces and simplify board-level design.
• Embedded Systems — Apply the device's logic capacity and on-chip RAM for deterministic control tasks and localized processing in embedded products.
• Interface Bridging — Gate-level resources and abundant I/O make the device suitable for protocol bridging and custom interface implementations.

Unique Advantages

• High I/O Integration: 298 I/O pins enable consolidation of peripheral connections and reduce the need for external I/O expander components.
• Balanced Logic and Memory: 3,872 logic elements paired with approximately 63 kbits of embedded RAM support a wide range of mid-scale logic functions without large external memory.
• Industrial Temperature Support: Rated for −40 °C to 85 °C, offering robustness for deployments in industrial and harsh-environment equipment.
• Compact BGA Package: 352-BBGA (35×35) delivers a small board footprint for space-constrained applications while maintaining high pin count.
• RoHS Compliant: Meets environmental compliance requirements for modern product assemblies.
• Flexible Power Range: 4 V to 6 V supply compatibility simplifies integration into systems using higher supply rails.

Why Choose OR3C804BA352I-DB?

The OR3C804BA352I-DB positions itself as a versatile mid-capacity FPGA solution delivering a balance of logic elements, embedded RAM, and one of the higher I/O counts in a compact 352-BBGA package. Its industrial temperature rating and RoHS compliance make it suitable for embedded and industrial designs that require reliable, configurable logic with substantial I/O integration.

This device is well suited for engineers and procurement teams building control systems, interface bridging solutions, or embedded platforms that need scalable, board-level programmable logic with straightforward thermal and supply requirements.

Request a quote or contact sales to discuss availability, pricing, and how the OR3C804BA352I-DB can fit your next design.