OR3C805BA352-DB

FPGA, 484 CLBS, 116000 GATES
Part Description

ORCA™3C Field Programmable Gate Array (FPGA) IC 298 63488 3872 352-BBGA

Quantity 142 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package352-PBGA (35x35)GradeCommercialOperating Temperature0°C – 70°C
Package / Case352-BBGANumber of I/O298Voltage4.5 V - 5.5 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs484Number of Logic Elements/Cells3872
Number of Gates116000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits63488

Overview of OR3C805BA352-DB – ORCA™3C Field Programmable Gate Array (FPGA) IC 298 63488 3872 352-BBGA

The OR3C805BA352-DB is an ORCA™3C Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for commercial applications requiring flexible, programmable logic. This surface-mount device combines 3,872 logic elements and 484 CLBs with 63,488 bits of on-chip RAM to support a range of custom digital functions.

With 298 user I/O pins, a gate-equivalent count of 116,000, and a 352-BBGA (352-PBGA, 35×35) package, the device is suited for I/O-dense designs that operate from a 4.5 V to 5.5 V supply within a 0 °C to 70 °C temperature range.

Key Features

  • Core Logic 3,872 logic elements and 484 CLBs provide the programmable fabric for implementing custom digital functions and control logic.
  • Embedded Memory Approximately 0.06 Mbits of on-chip RAM (63,488 bits) for buffers, small FIFOs and distributed storage.
  • I/O Capacity 298 user I/O pins support high-pin-count interfaces and multiple peripheral connections from a single device.
  • Design Scale Approximately 116,000 equivalent gates to accommodate medium-complexity logic implementations.
  • Power and Temperature Operates from 4.5 V to 5.5 V and is specified for commercial temperature operation from 0 °C to 70 °C.
  • Package and Mounting Available in a 352-BBGA package (supplier device package: 352-PBGA, 35×35) with surface-mount construction for board-level integration.
  • Compliance and Grade Commercial-grade device; RoHS compliant for environmental regulatory adherence.

Typical Applications

  • Interface and Protocol Bridging Use the device’s high I/O count to implement custom protocol translators and glue logic between multiple subsystems.
  • Embedded Control Implement control state machines and timing logic for appliances, instrumentation, and automation equipment within commercial temperature ranges.
  • Sensor and Data Aggregation Aggregate and pre-process signals from multiple sensors or peripheral devices using on-chip logic and embedded RAM.
  • Prototyping and Custom Logic Rapidly iterate custom digital functions and proof-of-concept designs that require reprogrammable logic and moderate resources.

Unique Advantages

  • Balanced Logic and Memory Capacity: 3,872 logic elements paired with 63,488 bits of embedded RAM provide a compact balance of logic and storage for medium-complexity designs.
  • High I/O Density: 298 I/O pins enable integration of multiple external interfaces without additional bridge devices, reducing board-level complexity.
  • Standard Commercial Voltage Range: 4.5 V to 5.5 V supply compatibility simplifies integration into existing 5 V systems and legacy platforms.
  • Robust Gate-Equivalent Capacity: ~116,000 gates give designers room to implement diverse control, timing, and glue-logic functions within a single FPGA.
  • Compact Surface-Mount Package: The 352-BBGA (35×35) package offers a high-density footprint for space-constrained PCBs while supporting surface-mount assembly.
  • Regulatory Compliance: RoHS compliance supports environmentally conscious designs and supply-chain requirements.

Why Choose OR3C805BA352-DB?

The OR3C805BA352-DB positions itself as a commercial-grade, mid-range FPGA solution that combines several thousand logic elements, modest embedded RAM, and nearly 300 I/O pins in a compact 352-BBGA package. It is suited to designers needing a reprogrammable, I/O-rich device for interface consolidation, custom control logic, and prototyping within a 0 °C to 70 °C operating window.

For teams focused on reducing board-level components while retaining flexibility, this ORCA™3C device delivers a balanced feature set, straightforward 5 V system integration, and RoHS compliance—offering a practical option for commercial embedded designs and development projects.

Request a quote or submit an inquiry to get pricing and availability for the OR3C805BA352-DB.

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