OR3L165B7BC432-DB
| Part Description |
ORCA™ OR3LxxxB Field Programmable Gate Array (FPGA) IC 516 134144 8192 432-LBGA Exposed Pad |
|---|---|
| Quantity | 1,749 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 432-EBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 432-LBGA Exposed Pad | Number of I/O | 516 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1024 | Number of Logic Elements/Cells | 8192 | ||
| Number of Gates | 244000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 134144 |
Overview of OR3L165B7BC432-DB – ORCA™ OR3LxxxB FPGA, 8,192 Logic Elements, 432-LBGA Exposed Pad
The OR3L165B7BC432-DB is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation in the ORCA™ OR3LxxxB series. It provides a mid-range integration point with 8,192 logic elements, on-chip embedded memory, and a large I/O count for commercial embedded designs.
Designed for surface-mount applications, this device combines significant logic capacity, approximately 0.134 Mbits of embedded memory (134,144 bits), and up to 516 I/O to support I/O-heavy and control-oriented commercial systems while operating from a 2.375 V to 2.625 V supply.
Key Features
- Core Logic 8,192 logic elements and approximately 244,000 gates provide substantial programmable logic capacity for mid-range designs.
- Embedded Memory Approximately 0.134 Mbits (134,144 bits) of on-chip RAM to implement buffers, FIFOs, and small data stores without external memory.
- I/O Density Up to 516 I/O pins to support complex interfacing and multiple peripheral connections.
- Package & Mounting 432-LBGA exposed pad package (supplier package: 432-EBGA 40×40) in a surface-mount form factor for compact board designs.
- Power Supply Operates from a 2.375 V to 2.625 V supply, enabling integration into systems with that supply domain.
- Operating Range Commercial temperature rating from 0 °C to 70 °C for general-purpose commercial deployments.
- Compliance RoHS compliant for regulatory alignment in commercial products.
Typical Applications
- Commercial Embedded Systems Implements control logic, protocol translation, and custom I/O handling in space-constrained commercial products.
- I/O-Intensive Controllers Supports systems that require many external interfaces thanks to up to 516 I/O pins.
- Prototyping and Development Provides a programmable platform for validating logic architectures and interface designs within a commercial temperature range.
Unique Advantages
- High Logic Integration: 8,192 logic elements and ~244,000 gates deliver substantial programmable capacity for mid-range designs, reducing the need for multiple discrete PLDs.
- On-Chip Memory: Approximately 0.134 Mbits of embedded RAM enables internal buffering and data handling without immediate external memory requirements.
- Extensive I/O: Up to 516 I/O pins simplify system-level interfacing and can reduce external interface components.
- Compact, Surface-Mount Package: 432-LBGA exposed pad (432-EBGA 40×40) minimizes board area while providing a standardized SMD footprint.
- Commercial-Range Operation: Rated for 0 °C to 70 °C, aligning with commercial product requirements.
- Regulatory Compliance: RoHS compliance helps meet environmental and supply-chain requirements for commercial products.
Why Choose OR3L165B7BC432-DB?
The OR3L165B7BC432-DB balances significant programmable logic capacity with a high I/O count and on-chip memory, making it well suited for commercial embedded designs that require moderate logic integration and flexible interfacing. Its surface-mount 432-LBGA exposed pad package supports compact board layouts while the specified 2.375 V to 2.625 V supply and 0 °C to 70 °C operating range align it to a wide range of commercial applications.
Manufactured by Lattice Semiconductor Corporation, this FPGA is positioned for design teams seeking a mid-range, RoHS-compliant programmable device that integrates logic, memory, and extensive I/O in a single package.
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