OR3L165B7PS208I-DB

The OR3L165B7PS208I-DB is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, featuring 8,192 logic elements and approximately 0.134 Mbits of embedded memory. Designed as a surface-mount industrial-grade FPGA, it offers a high I/O count and dense logic capacity in a 208‑BFQFP exposed pad package.

With 516 I/Os, 244,000 gates and a compact 208‑pin footprint, this device targets applications that require extensive I/O connectivity and moderate programmable logic capacity while operating over an industrial temperature range and a defined core supply window.

Key Features

• Logic Capacity — 8,192 logic elements and 1,024 LABs/CLBs equivalent, delivering 244,000 gates for implementing custom digital logic and glue‑logic functions.
• Embedded Memory — Total on‑chip RAM of 134,144 bits, approximately 0.134 Mbits of embedded memory for FIFOs, buffering, and small lookup tables.
• I/O Density — 516 general-purpose I/O pins to support high‑pin‑count interfaces and parallel connectivity requirements.
• Package and Mounting — 208‑BFQFP exposed pad package (supplier device package: 208‑SQFP2, 28×28), optimized for surface‑mount assembly with an exposed pad for thermal management.
• Power Supply — Core supply range of 2.375 V to 2.625 V, enabling deterministic power budgeting within the specified window.
• Operating Range — Industrial temperature grade with an operating range of −40 °C to 85 °C for deployment in temperature‑sensitive environments.
• Compliance — RoHS compliant, supporting lead‑free assembly and regulatory requirements for environmental safety.

Unique Advantages

• High I/O Count: 516 I/Os enable complex multi‑interface designs and dense sensor or peripheral connectivity without external multiplexing.
• Balanced Logic and Memory: 8,192 logic elements combined with approximately 0.134 Mbits of RAM provide capacity for control logic, state machines, and modest data buffering within a single device.
• Industrial Reliability: Specified for −40 °C to 85 °C operation and offered in a robust exposed‑pad package for enhanced thermal performance in industrial applications.
• Compact, Assembly‑Ready Package: 208‑pin BFQFP with exposed pad supports surface‑mount production flows and facilitates board‑level thermal coupling.
• Defined Supply Window: Narrow core voltage range (2.375 V–2.625 V) simplifies power rail design and helps ensure predictable device behavior.
• Environmentally Compliant: RoHS compliance supports regulatory and customer requirements for lead‑free designs.

Why Choose OR3L165B7PS208I-DB?

The OR3L165B7PS208I-DB positions itself as a practical FPGA choice when a balance of logic capacity, substantial I/O, and industrial temperature operation are required. Its combination of 8,192 logic elements, 516 I/Os, and a 208‑pin exposed‑pad package makes it suitable for board designs that need dense connectivity and reliable thermal management in industrial environments.

Engineers and procurement teams will find this Lattice Semiconductor device useful for mid‑range programmable logic tasks where predictable power requirements, RoHS compliance, and an industrial operating range are key selection criteria.

Request a quote or submit your pricing inquiry to receive availability, lead‑time, and volume pricing information for the OR3L165B7PS208I-DB. Our team will respond with a tailored quote to support your project planning and procurement needs.