OR3L165B7PS240-DB

FPGA, 1024 CLBS, 120000 GATES
Part Description

ORCA™ OR3LxxxB Field Programmable Gate Array (FPGA) IC 516 134144 8192 240-BFQFP Exposed Pad

Quantity 1,632 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package240-SQFP2 (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O516Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Affected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1024Number of Logic Elements/Cells8192
Number of Gates244000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits134144

Overview of OR3L165B7PS240-DB – ORCA™ OR3LxxxB FPGA IC, 8,192 Logic Elements, 516 I/Os

The OR3L165B7PS240-DB is an ORCA™ OR3LxxxB field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It integrates 8,192 logic elements with approximately 0.134 Mbits of on-chip RAM and supports up to 516 I/O pins in a 240-BFQFP exposed pad package.

Designed for commercial-grade applications, this surface-mount FPGA operates from a 2.375 V to 2.625 V supply and is specified for 0 °C to 70 °C operation. It is RoHS compliant.

Key Features

  • Core Logic  8,192 logic elements providing general-purpose programmable logic capacity for custom digital functions.
  • Logic Cluster Count  1,024 logic clusters (CLBs) to organize fabric resources for synthesis and implementation.
  • Embedded Memory  Approximately 0.134 Mbits (134,144 bits) of on-chip RAM for data buffering and small memory requirements.
  • I/O Density  516 available I/O pins to support wide peripheral connectivity and flexible interfacing.
  • Gate Equivalent  244,000 equivalent gates to indicate overall logic scale for architectural planning.
  • Power and Temperature  Low-voltage operation with a supply range of 2.375 V to 2.625 V and a commercial operating temperature range of 0 °C to 70 °C.
  • Package and Mounting  240-BFQFP with exposed pad (supplier package: 240-SQFP2, 32×32) in a surface-mount form factor for PCB-level thermal and assembly considerations.
  • Environmental Compliance  RoHS compliant for regulatory and manufacturing alignment.

Unique Advantages

  • High logic capacity: 8,192 logic elements support medium-complexity digital designs without immediate need for external logic expansion.
  • Dense I/O count: 516 I/Os enable broad peripheral connectivity and flexible signal routing on a single device.
  • Compact, manufacturable package: 240-BFQFP with exposed pad in a 32×32 footprint facilitates thermal management and surface-mount assembly.
  • Low-voltage operation: Narrow supply range (2.375 V–2.625 V) simplifies power rail planning in low-voltage systems.
  • Commercial temperature rating: Specified 0 °C–70 °C operation aligns with standard commercial deployments and product environments.
  • Regulatory readiness: RoHS compliance supports modern electronics manufacturing requirements.

Why Choose OR3L165B7PS240-DB?

The OR3L165B7PS240-DB offers a balanced combination of programmable logic capacity, on-chip memory, and high I/O density in a compact surface-mount package. It is well suited to commercial embedded designs that require moderate logic resources, significant peripheral connectivity, and RoHS-compliant hardware.

This FPGA is appropriate for customers looking to integrate configurable digital logic into space-constrained PCBs while maintaining a clear power and thermal profile. The device’s specifications make it a practical choice for scalable prototypes and production systems that operate within standard commercial temperature ranges.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the OR3L165B7PS240-DB.

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