OR3L165B7BM680I-DB

The OR3L165B7BM680I-DB is an ORCA™ OR3LxxxB field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It provides a programmable logic fabric with 8,192 logic elements and on-chip embedded memory for implementing custom digital functions.

Designed and specified for industrial use, this surface-mount FPGA combines a high I/O count and a compact 680-BBGA (680-PBGAM, 35 × 35 mm) package with a single-core voltage supply range and extended temperature rating to meet robust embedded design requirements.

Key Features

• Programmable Logic 8,192 logic elements enable implementation of complex custom logic and state machines.
• On-Chip Memory Approximately 0.134 Mbits of embedded memory (134,144 total RAM bits) for buffering, FIFOs, and small data structures.
• I/O Density 516 user I/O pins provide extensive interfacing capability for parallel buses, control signals, and peripheral connections.
• Gate Equivalent 244,000 gates (gate-equivalent metric) for sizing and system resource planning.
• Package and Mounting 680-BBGA package (supplier device package: 680-PBGAM, 35 × 35 mm) in a surface-mount form factor for space-efficient board integration.
• Power Single-supply operating range of 2.375 V to 2.625 V for core power budgeting and regulator selection.
• Temperature Range Industrial operating temperature rating from −40 °C to 85 °C for deployment in demanding environments.
• Compliance RoHS compliant.

Typical Applications

• Industrial Control Systems Use the FPGA’s 8,192 logic elements and industrial temperature rating to implement deterministic control, signal processing, and interface bridging in automation equipment.
• Embedded Custom Logic Implement custom state machines, protocol handling, and glue logic where a high I/O count and on-chip RAM simplify board-level design.
• Communications and Networking Hardware Leverage 516 I/O pins and dense logic resources for port aggregation, protocol translation, and parallel data paths in network equipment.

Unique Advantages

• High Logic Density: 8,192 logic elements provide a substantial resource pool for implementing complex custom functions without external ASICs.
• Large I/O Count: 516 I/O pins reduce the need for external multiplexing or I/O expanders when interfacing many peripherals or parallel buses.
• Compact, High-Pin Package: 680-BBGA (35 × 35 mm) provides high pin density in a surface-mount footprint, aiding compact board layouts.
• Industrial Robustness: Rated for −40 °C to 85 °C operation and supplied in an industrial-grade device class for reliable performance in harsh environments.
• predictable Power Envelope: A defined core voltage range (2.375 V–2.625 V) simplifies power-supply design and thermal planning.
• Standards Compliance: RoHS compliance supports regulatory and environmental requirements for production designs.

Why Choose OR3L165B7BM680I-DB?

The OR3L165B7BM680I-DB positions itself as a compact, industrial-grade FPGA option that balances logic capacity, I/O density, and on-chip memory. Its 8,192 logic elements and 516 I/O pins suit designs that require sizeable programmable logic and broad interfacing without moving to larger, more expensive packages.

This device is well suited for engineers building industrial control, embedded systems, or communications hardware where package density, a defined power envelope, and extended temperature operation matter. The combination of resources and package options supports scalable designs and straightforward board integration.

Request a quote or submit your requirements today to get pricing and availability for the OR3L165B7BM680I-DB. Our team can provide lead-time information and support for volume inquiries.