OR3L165B7BA352-DB

The OR3L165B7BA352-DB is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation’s ORCA™ family. It delivers a balance of programmable logic, on-chip RAM and a high I/O count in a compact BGA package suited to commercial-temperature applications.

With 8,192 logic elements, approximately 0.13 Mbits of embedded RAM, and 516 I/Os, this device targets embedded systems, consumer electronics and communications equipment that require flexible digital logic and dense I/O integration while operating from a 2.375 V to 2.625 V supply.

Key Features

• Core Logic 8,192 logic elements provide the configurable logic capacity for custom digital functions and glue logic.
• Embedded Memory Approximately 0.13 Mbits of on-chip RAM (134,144 total RAM bits) for buffering, small FIFOs and state storage.
• High I/O Count 516 I/Os enable dense external device interfacing and support for multiple parallel interfaces.
• Gate Density 244,000 equivalent gates for mapping complex combinational and sequential logic.
• Power Operates from a 2.375 V to 2.625 V supply, simplifying integration with compatible low-voltage systems.
• Package & Mounting 352-BBGA package (supplier package: 352-PBGA (35x35)), surface-mount construction for compact PCB designs.
• Commercial Temperature & Compliance Rated for 0 °C to 70 °C operation and RoHS compliant for commercial applications.

Typical Applications

• Embedded Control Systems Implement custom control logic and peripheral management using the device’s logic elements and on-chip RAM.
• Consumer Electronics Integrate interface glue, display/UX controllers or peripheral aggregation in space-constrained product designs.
• Communications & Interface Bridging Use the extensive I/O count and embedded memory for protocol conversion, buffering and multichannel I/O handling.
• Prototyping and Evaluation Leverage reprogrammable logic to iterate hardware functions and validate designs before production.

Unique Advantages

• High Logic Capacity: 8,192 logic elements allow flexible implementation of custom digital functions without external ASIC development.
• Dense External Connectivity: 516 I/Os reduce the need for additional I/O expanders and simplify board-level interfacing.
• On-Chip Memory: Approximately 0.13 Mbits of RAM supports local buffering and state storage to improve data handling and latency.
• Compact BGA Footprint: The 352-BBGA / 352-PBGA (35x35) package enables a smaller PCB footprint for compact product designs.
• Low-Voltage Operation: 2.375 V to 2.625 V supply range aligns with modern low-voltage system rails.
• RoHS Compliant: Meets RoHS requirements for commercial hardware manufacturing.

Why Choose OR3L165B7BA352-DB?

The OR3L165B7BA352-DB delivers a practical combination of logic capacity, embedded RAM and a very high I/O count in a compact BGA package, making it well suited for commercial embedded designs where space and interface density matter. Its commercial temperature rating and low-voltage operation make it appropriate for a wide range of consumer and communications products.

Produced by Lattice Semiconductor Corporation, this FPGA offers designers reprogrammable flexibility to iterate functionality, consolidate discrete logic, and reduce bill-of-materials in projects that require moderate logic density and extensive external connectivity.

Request a quote today to receive pricing and lead-time information for the OR3L165B7BA352-DB. Submit a quotation request to begin the procurement process.