OR3L165B7PS208-DB

The OR3L165B7PS208-DB is a commercial-grade FPGA IC from Lattice Semiconductor Corporation featuring 8,192 logic elements and a dense I/O complement. It provides on-chip RAM and a significant gate count in a 208-BFQFP exposed pad surface-mount package, offering a compact programmable fabric for commercial embedded designs.

This device targets commercial electronic applications that require flexible logic integration, high I/O density, and a modest embedded memory footprint, while operating within a 2.375 V to 2.625 V supply range and a 0 °C to 70 °C temperature window.

Key Features

• Logic Capacity — 8,192 logic elements provide the core programmable resources for implementing custom digital functions.
• On-Chip Memory — 134,144 total RAM bits of embedded memory for buffering, FIFOs, and small data storage requirements.
• I/O Density — 516 programmable I/O pins to support wide parallel interfaces, multiple peripherals, and board-level integration without extensive external logic.
• Gate Complexity — Approximately 244,000 gates enabling moderately complex logic and glue functions inside a single device.
• Power and Supply — Core operating voltage range of 2.375 V to 2.625 V to match low-voltage system domains.
• Package and Mounting — 208-BFQFP exposed pad package (supplier device package: 208-SQFP2, 28 × 28 mm) in a surface-mount form factor for conventional PCB assembly.
• Commercial Temperature Grade — Rated for operation from 0 °C to 70 °C for commercial applications.
• RoHS Compliant — Conforms to RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic and peripheral interfaces using the device’s programmable logic and high I/O count.
• Consumer Electronics — Integrate display drivers, user-interface control, and signal routing within a compact surface-mount package.
• Prototyping and Evaluation — Use the FPGA’s reprogrammable fabric and available logic elements to validate algorithms and iterate hardware designs quickly.
• Communications and Connectivity — Manage parallel and serial interface aggregation with the large set of I/O lines and embedded RAM for buffering.

Unique Advantages

• High I/O Count: 516 I/O pins reduce the need for external expanders and simplify board-level connectivity for multi-interface designs.
• Balanced Logic and Memory: 8,192 logic elements combined with 134,144 bits of on-chip RAM provide a compact solution for mid-range logic and buffering needs.
• Compact, Surface-Mount Package: 208-BFQFP exposed pad packaging offers a manageable PCB footprint while supporting thermal conduction through the exposed pad.
• Commercial Temperature Suitability: Rated 0 °C to 70 °C to match typical commercial product environmental requirements.
• RoHS Compliance: Supports lead-free manufacturing flows for regulatory and environmental alignment.

Why Choose OR3L165B7PS208-DB?

The OR3L165B7PS208-DB positions itself as a flexible, mid-capacity FPGA option for commercial designs that need a substantial I/O count and a practical mix of logic resources and embedded memory. Its 208-BFQFP exposed pad package and surface-mount mounting make it suitable for compact PCB layouts where programmable integration reduces BOM complexity.

This device is suited for engineers and procurement teams developing commercial electronics, prototypes, and connectivity equipment who require a reprogrammable solution with defined power and temperature characteristics, and supply-chain friendly RoHS compliance from a recognized FPGA manufacturer.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the OR3L165B7PS208-DB. Our team can provide lead-time details and support documentation to assist your evaluation and procurement process.