OR3L165B8PS208-DB

The OR3L165B8PS208-DB is an ORCA™ OR3LxxxB Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a mid-range logic resource set with 8,192 logic elements, approximately 0.13 Mbits of embedded RAM and a high I/O count, packaged for surface-mount deployment.

Designed for commercial-temperature applications, this device targets designs that require a balance of logic capacity, embedded memory and extensive I/O in a 208-BFQFP exposed pad package while operating from a 2.375 V to 2.625 V supply.

Key Features

• Core Logic: 8,192 logic elements and approximately 244,000 gates provide the device's programmable logic capacity for custom digital functions.
• Embedded Memory: Approximately 0.13 Mbits of on-chip RAM (134,144 bits) for buffering, small LUT-based memories and state storage.
• I/O Density: 516 general-purpose I/O pins to support designs that require extensive external connectivity and signal interfacing.
• Package & Mounting: 208-BFQFP exposed pad package (supplier package: 208-SQFP2, 28×28) with surface-mount construction for PCB-level integration and thermal grounding via exposed pad.
• Power: Supply voltage range of 2.375 V to 2.625 V for core operation.
• Operating Conditions: Commercial-grade operation from 0 °C to 70 °C.
• Environmental Compliance: RoHS compliant.

Typical Applications

• High‑I/O Interface Modules: Use the 516 I/O pins to consolidate and manage multiple parallel or serial interfaces where large pin counts are needed.
• Custom Logic and Glue‑Logic: Implement application‑specific data paths and control logic leveraging 8,192 logic elements to replace discrete glue logic and small CPLD solutions.
• Embedded Memory Buffering: Employ the on‑chip RAM (134,144 bits) for packet buffering, small FIFOs or configuration state storage in mixed-signal or digital designs.

Unique Advantages

• High I/O Count: 516 I/O pins reduce the need for external multiplexers or expanders in pin‑dense systems, simplifying board design.
• Balanced Logic Capacity: 8,192 logic elements and ~244,000 gates offer a practical mid-range resource set for many custom digital functions without over‑provisioning.
• Compact Surface‑Mount Package: 208-BFQFP exposed pad (28×28 SQFP2) allows for a thermally anchored, space-efficient footprint suitable for surface-mount assembly.
• Controlled Supply Range: The defined 2.375 V to 2.625 V supply window simplifies power-rail planning for systems targeting this core voltage.
• Commercial‑Grade Temperature: Rated 0 °C to 70 °C for applications within standard commercial operating environments.
• RoHS Compliant: Meets RoHS requirements for environmentally compliant assembly processes.

Why Choose OR3L165B8PS208-DB?

The OR3L165B8PS208-DB positions itself as a versatile FPGA option for commercial designs that require a substantial I/O count paired with mid-range programmable logic and on‑chip RAM. Its combination of 8,192 logic elements, ~0.13 Mbits of embedded memory and 516 I/Os supports consolidation of multiple functions into a single programmable device while the 208‑pin exposed‑pad package aids thermal management and compact PCB layouts.

This device is appropriate for engineers and procurement teams building solutions that benefit from integrated logic and dense external connectivity within typical commercial temperature ranges and a defined core supply voltage. Its RoHS compliance and surface-mount packaging align with modern manufacturing and assembly practices.

Request a quote or submit a purchase inquiry to receive pricing and availability for the OR3L165B8PS208-DB and bring this ORCA™ FPGA into your next design.