OR3L225B8BC432-DB

The OR3L225B8BC432-DB is an ORCA™ series field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It provides a mid-range programmable logic fabric with 11,552 logic elements, approximately 189,440 bits of on-chip RAM, and up to 612 I/O pins in a compact 432‑LBGA exposed pad package.

Designed for commercial-grade applications, this surface-mount FPGA delivers a combination of logic capacity, memory, and high I/O density for board-level designs that require flexible, field-programmable logic within a defined supply and temperature envelope.

Key Features

• Core Logic  Approximately 11,552 logic elements and an estimated 340,000 gates provide the programmable fabric for custom logic, state machines, and glue-logic implementations.
• Embedded Memory  About 189,440 bits of on-chip RAM support data buffering, small lookup tables, and local storage for deterministic logic functions.
• I/O Density  Up to 612 available I/O pins enable complex interfacing and connectivity to peripherals, sensors, or external logic devices.
• Package & Mounting  432‑LBGA exposed pad package (supplier designation: 432‑EBGA, 40×40) in a surface-mount form factor for high-density board integration.
• Power Supply  Specified operating supply range of 2.375 V to 2.625 V for core or specified rails.
• Operating Conditions & Grade  Commercial grade with an operating temperature range of 0 °C to 70 °C.
• Regulatory Compliance  RoHS compliant, enabling use in designs that require lead-free, restricted-substance compliance.

Typical Applications

• Custom Logic and Prototyping  Deploy where up to 11,552 logic elements are required to implement custom state machines, glue logic, or prototype designs before ASIC migration.
• High‑Density I/O Interfacing  Use the device for board designs that need many external connections—up to 612 I/O—such as multi-channel data aggregation or complex peripheral routing.
• Embedded Memory‑Centric Functions  Leverage approximately 189,440 bits of on-chip RAM for small buffers, FIFOs, and lookup tables within control or data-path logic.
• Compact Board‑Level Integration  The 432‑LBGA exposed pad package and surface-mount mounting make this FPGA suitable for space-constrained PCBs requiring high integration density.

Unique Advantages

• High Logic Capacity:  Approximately 11,552 logic elements support significant custom logic without moving to a larger device family.
• Generous I/O Count:  612 I/O pins accommodate complex external interfaces and reduce the need for additional I/O expanders.
• On‑Chip Memory:  About 189,440 bits of embedded RAM enable local buffering and memory-backed logic functions, simplifying system architecture.
• Compact, Board‑Friendly Package:  432‑LBGA exposed pad (432‑EBGA, 40×40) balances pin density with a small PCB footprint for compact designs.
• Defined Commercial Operating Range:  Specified 0 °C to 70 °C operating temperature and RoHS compliance align the device with standard commercial electronic designs.
• Controlled Power Requirements:  A clear supply range of 2.375 V to 2.625 V aids predictable power budgeting on multi-rail boards.

Why Choose OR3L225B8BC432-DB?

The OR3L225B8BC432-DB positions itself as a mid-range, commercial-grade FPGA option from Lattice Semiconductor Corporation that combines a substantial logic element count, meaningful on-chip RAM, and very high I/O density in a compact LBGA package. Its defined supply range, package options, and RoHS compliance make it suitable for designers balancing integration density and predictable operating conditions.

This FPGA is well suited for designers and teams implementing custom logic, complex interface routing, or memory-backed control functions on space-constrained PCBs. Backed by Lattice Semiconductor as the manufacturer, the device offers a clear specification set for procurement and system integration into commercial electronic products.

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