OR3T1256BC432-DB
| Part Description |
ORCA™3C Field Programmable Gate Array (FPGA) IC 342 102400 6272 432-LBGA Exposed Pad |
|---|---|
| Quantity | 18 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 432-EBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 432-LBGA Exposed Pad | Number of I/O | 342 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 784 | Number of Logic Elements/Cells | 6272 | ||
| Number of Gates | 186000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 102400 |
Overview of OR3T1256BC432-DB – ORCA™3C Field Programmable Gate Array (FPGA) IC 342 102400 6272 432-LBGA Exposed Pad
The OR3T1256BC432-DB is an ORCA™3C Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It delivers a balance of logic capacity, embedded RAM and I/O count in a compact 432-LBGA exposed pad package.
With 6,272 logic elements, 102,400 bits of on-chip RAM and 342 I/O, this FPGA is suitable for designs that require moderate logic density combined with substantial external connectivity, while operating from a 3.0–3.6 V supply range at commercial temperature grades.
Key Features
- Logic Capacity 6,272 logic elements providing the core programmable fabric for custom logic, state machines and glue logic.
- Embedded Memory 102,400 bits of on-chip RAM for buffering, small FIFOs and state storage.
- I/O Count 342 general-purpose I/O pins to support multiple external interfaces and dense connectivity requirements.
- Gate Count 186,000 gates enabling implementation of complex combinational and sequential functions.
- Package & Mounting 432-LBGA exposed pad package (supplier device package: 432-EBGA, 40×40) with surface-mount mounting for compact PCB integration.
- Power Operates from a 3.0 V to 3.6 V supply range to match common system power rails.
- Temperature Grade Commercial operating temperature range of 0 °C to 70 °C for typical commercial applications.
- Regulatory RoHS compliant.
Typical Applications
- Embedded control and logic consolidation Use the FPGA to implement custom control logic, protocol handling and glue logic where 6,272 logic elements and on-chip RAM are sufficient.
- High-density I/O systems Designs that require large peripheral connectivity can take advantage of the 342 available I/O pins.
- Interface bridging and protocol adaptation Implement protocol translation or interface aggregation functions using the available logic and memory resources.
Unique Advantages
- Balanced logic and memory Combines 6,272 logic elements with 102,400 bits of RAM to support a range of mid-density FPGA designs without external memory for small buffers.
- High I/O availability 342 I/O pins simplify routing of multiple interfaces and reduce the need for external multiplexing components.
- Compact surface-mount package The 432-LBGA exposed pad (40×40 EBGA) offers a space-efficient footprint for board-level integration.
- Simple power requirements Single 3.0–3.6 V supply range aligns with common system power rails for straightforward power management.
- RoHS compliant Environmentally compliant for standard commercial deployments.
Why Choose OR3T1256BC432-DB?
OR3T1256BC432-DB is positioned for designers needing a commercial-grade FPGA with a combination of moderate logic density, substantial I/O and on-chip RAM in a compact LBGA package. Its specifications—6,272 logic elements, 102,400 bits of RAM, 342 I/O and operation from a 3.0–3.6 V supply—make it well suited to mid-range embedded and interface-focused designs.
Manufactured by Lattice Semiconductor Corporation and offered in a RoHS-compliant 432-LBGA exposed pad package, this device provides a practical option for projects that require reliable, space-efficient programmable logic with a commercial operating temperature range.
Request a quote or submit an inquiry to our sales team for pricing, availability and lead-time information for the OR3T1256BC432-DB.

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