OR3T1256BC600-DB
| Part Description |
ORCA™3C Field Programmable Gate Array (FPGA) IC 448 102400 6272 600-BGA Exposed Pad |
|---|---|
| Quantity | 299 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 600-EBGA | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 600-BGA Exposed Pad | Number of I/O | 448 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 784 | Number of Logic Elements/Cells | 6272 | ||
| Number of Gates | 186000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 102400 |
Overview of OR3T1256BC600-DB – ORCA™3C Field Programmable Gate Array (FPGA), 600-BGA Exposed Pad
The OR3T1256BC600-DB is an ORCA™3C Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. This commercial‑grade FPGA integrates 6,272 logic elements, approximately 0.1 Mbits of embedded memory, 448 user I/Os and an estimated 186,000 gates in a 600-BGA exposed pad package.
It is specified for surface-mount assembly, operates from a 3 V to 3.6 V supply, and is rated for a 0 °C to 70 °C operating temperature range. The device is RoHS compliant.
Key Features
- Core Architecture Field Programmable Gate Array (FPGA) IC providing programmable logic resources for custom digital designs.
- Logic Capacity 6,272 logic elements to implement combinational and sequential logic functions and mid-density design requirements.
- Embedded Memory Approximately 0.1 Mbits of on-chip RAM for buffering, small FIFOs and state storage.
- I/O and Gate Count 448 I/Os for broad interfacing capability and an estimated 186,000 gates for moderate integration density.
- Power and Temperature Operates from a 3 V to 3.6 V supply and is specified for commercial operation from 0 °C to 70 °C.
- Package and Mounting 600-BGA exposed pad (600-EBGA supplier package) designed for surface-mount assembly to support compact, high-pin-count board layouts.
- Compliance RoHS compliant to meet standard environmental requirements for lead-free assembly.
Typical Applications
- High-density I/O and interface bridging Use the 448 I/Os to consolidate multiple serial and parallel interfaces or to implement protocol bridging on constrained boards.
- Mid-density logic consolidation Leverage 6,272 logic elements and 186,000 gates to integrate glue logic, state machines, and moderate processing blocks that reduce external components.
- On-board buffering and small-data storage Utilize approximately 0.1 Mbits of embedded RAM for FIFOs, packet buffering or temporary data storage within system logic.
Unique Advantages
- Substantial I/O count: 448 I/Os enable complex interfacing without external multiplexers, simplifying PCB routing and system integration.
- Balanced logic and memory: The combination of 6,272 logic elements and embedded RAM supports a wide range of mid-density digital functions within a single device.
- Compact high-pin-count package: 600-BGA exposed pad provides high connectivity in a space-efficient footprint suited to compact assemblies.
- Commercial temperature rating: Specified 0 °C to 70 °C operation matches standard commercial product requirements.
- RoHS compliant: Meets lead-free assembly requirements for modern manufacturing processes.
Why Choose OR3T1256BC600-DB?
The OR3T1256BC600-DB positions itself as a practical choice for designers needing a mid-density FPGA with substantial I/O and on-chip memory in a compact 600-BGA footprint. Its combination of 6,272 logic elements, approximately 0.1 Mbits of embedded RAM and 448 I/Os supports consolidation of interface logic, buffering and control functions while simplifying board-level integration.
Targeted at commercial-grade applications that operate within a 0 °C to 70 °C range and a 3 V to 3.6 V supply, this RoHS-compliant FPGA suits projects that require a balance of integration density, pin count and package efficiency.
Request a quote or submit an RFQ to receive pricing and availability for the OR3T1256BC600-DB. Provide your required quantities and delivery timeline to initiate a formal quotation.
