OR3T1256BC600I-DB

The OR3T1256BC600I-DB is an ORCA™3C Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a mid-density programmable logic resource set with 6,272 logic elements, approximately 0.10 Mbits of embedded RAM, and 448 user I/O pins in a 600‑BGA exposed pad package.

Designed for industrial-temperature operation and surface-mount assembly, this device targets embedded and system designs that require high I/O count, on-chip memory, and flexible programmable logic within a compact BGA footprint.

Key Features

• Logic Capacity  6,272 logic elements delivering programmable combinational and sequential logic resources for implementing control, glue-logic, and moderate-density custom logic functions.
• Configurable Logic Blocks (CLBs)  784 CLB units for structured logic placement and optimization within the device architecture.
• On-Chip Memory  Approximately 0.10 Mbits (102,400 bits) of embedded RAM to support FIFOs, buffering, and small data storage requirements without external memory.
• I/O Density  448 user I/O pins suitable for high-pin-count interfaces, parallel buses, and multi-channel I/O scenarios.
• Gate Equivalent  186,000 gates to provide an industry-readable metric of overall capacity for system partitioning and comparison.
• Power and Thermal  Operates from a 3.0 V to 3.6 V supply range; packaged in a 600‑BGA with exposed pad to support thermal dissipation in board-level designs.
• Industrial Grade and Temperature Range  Rated for -40 °C to 85 °C operation to meet a broad set of industrial and commercial environmental requirements.
• Mounting & Compliance  Surface-mount device in a 600‑EBGA supplier package; RoHS compliant for environmental regulatory compatibility.

Typical Applications

• Industrial control and automation  High I/O count and industrial temperature rating make this FPGA suitable for sensor interfacing, protocol bridging, and control logic in factory and process automation equipment.
• Communications and networking  Use the device for parallel and serial interface glue logic, packet buffering with on-chip RAM, and multi-channel I/O management.
• Embedded system integration  Deploy programmable logic to consolidate discrete components, implement custom peripherals, or accelerate deterministic functions within embedded platforms.

Unique Advantages

• High I/O count for complex interfaces: 448 user I/Os simplify board-level routing when managing multiple buses or parallel interfaces.
• Balanced logic and memory: 6,272 logic elements paired with approximately 0.10 Mbits of RAM support mixed control, buffering, and interface functions without immediate reliance on external memory.
• Industrial temperature rating: Specified operation from -40 °C to 85 °C enables deployment in a wide range of environmental conditions.
• Compact, thermally-aware package: 600‑BGA with exposed pad aids thermal management in space-constrained PCBs while maintaining a surface-mount assembly process.
• Standard supply voltage: 3.0 V to 3.6 V operation aligns with common board power rails for straightforward integration.
• Regulatory readiness: RoHS compliance supports environmentally conscious product builds and procurement requirements.

Why Choose OR3T1256BC600I-DB?

The OR3T1256BC600I-DB provides a balanced combination of logic density, embedded memory, and high I/O capacity in a compact 600‑BGA exposed pad package. Its industrial temperature rating and standard supply voltage make it a practical choice for engineers building embedded systems, communications interfaces, or automation equipment that call for programmable logic and significant pin count.

This device is well suited for design teams seeking to consolidate discrete functions into a single programmable device, reduce BOM complexity, and maintain thermal and environmental robustness on production PCBs.

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