OR3T1256PS240I-DB
| Part Description |
ORCA™3C Field Programmable Gate Array (FPGA) IC 192 102400 6272 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 176 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 240-SQFP2 (32x32) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 192 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | N/A | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 784 | Number of Logic Elements/Cells | 6272 | ||
| Number of Gates | 186000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 102400 |
Overview of OR3T1256PS240I-DB – ORCA™3C FPGA, 6,272 Logic Elements, 192 I/O, 240-BFQFP
The OR3T1256PS240I-DB is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation in the ORCA™3C family. It provides a mid-range FPGA fabric with 6,272 logic elements, approximately 0.10 Mbits of embedded RAM, and 192 programmable I/O pins in a 240-BFQFP exposed pad package.
Designed for industrial-grade applications, this device targets systems that require significant I/O density and configurable logic within a 3.0 V–3.6 V supply domain and an operating range of −40°C to 85°C.
Key Features
- Core Logic — 6,272 logic elements supporting a total of 186,000 gates for implementing custom digital logic and state machines.
- Embedded Memory — Approximately 0.10 Mbits of on-chip RAM to store lookup tables, buffering, and small data structures directly in the FPGA fabric.
- I/O Density — 192 programmable I/O pins suitable for interfacing with sensors, peripherals, and parallel buses.
- Power — Single supply range of 3.0 V to 3.6 V to match common system power rails.
- Package & Mounting — 240-BFQFP (exposed pad) / 240-SQFP2 (32×32) surface-mount package for compact board-level implementation and thermal conduction through the exposed pad.
- Industrial Temperature Range — Rated for operation from −40°C to 85°C, suitable for industrial environments.
- Regulatory — RoHS compliant.
Typical Applications
- Industrial Control & Automation — Use the device’s industrial temperature rating and 192 I/O to implement motor control logic, sensor aggregation, and real-time control interfaces.
- Embedded System Integration — Mid-range logic density and on-chip RAM enable custom peripheral glue logic, protocol handling, and compact system-on-board designs.
- Interface Bridging & I/O Expansion — High I/O count supports parallel bus bridging, level translation controllers, and multi-channel I/O aggregation.
Unique Advantages
- Balanced Logic Capacity: 6,272 logic elements and 186,000 gates provide a middle ground for designs that need more than small CPLDs but do not require very large FPGAs.
- Generous I/O Count: 192 I/O pins allow flexible connectivity options without external multiplexing hardware, simplifying board-level design.
- Compact, Manufacturable Package: 240-BFQFP exposed pad surface-mount package supports thermal dissipation and straightforward PCB assembly.
- Industrial Temperature Rating: −40°C to 85°C operation ensures suitability for a wide range of industrial deployments.
- Standard Supply Voltage: 3.0 V–3.6 V compatibility eases integration into existing 3.3 V systems.
- Environmental Compliance: RoHS compliance supports regulatory requirements for many commercial and industrial products.
Why Choose OR3T1256PS240I-DB?
The OR3T1256PS240I-DB offers a practical combination of logic density, on-chip memory, and substantial I/O capability in an industrial-rated FPGA package. It is well suited for engineers developing embedded systems, control electronics, and interface-intensive applications where a mid-range programmable fabric and broad I/O are required.
With a 240-BFQFP exposed pad package for surface-mount assembly and a standard 3.0 V–3.6 V supply range, this FPGA integrates into production designs while meeting environmental and temperature requirements common in industrial deployments.
Request a quote or submit an inquiry for OR3T1256PS240I-DB to receive pricing and availability information.

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Headquarters: Hillsboro, Oregon, USA
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