OR3T1256PS208-DB
| Part Description |
ORCA™3C Field Programmable Gate Array (FPGA) IC 171 102400 6272 208-BFQFP Exposed Pad |
|---|---|
| Quantity | 968 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-SQFP2 (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP Exposed Pad | Number of I/O | 171 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | N/A | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 784 | Number of Logic Elements/Cells | 6272 | ||
| Number of Gates | 186000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 102400 |
Overview of OR3T1256PS208-DB – ORCA™3C FPGA, 6,272 logic elements, 171 I/Os, 208-BFQFP
The OR3T1256PS208-DB is an ORCA™3C Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It integrates 6,272 logic elements, approximately 102,400 bits of on‑chip RAM, and 171 I/Os in a 208‑BFQFP exposed pad package for compact, surface‑mount board designs. This commercial‑grade device is intended for embedded designs requiring moderate logic density and a high count of general‑purpose I/O in a standard 28×28 package footprint.
Key Features
- Core Logic 6,272 logic elements distributed across 784 logic array blocks, representing approximately 186,000 gates for mid‑range logic implementation.
- On‑Chip Memory Total embedded RAM of 102,400 bits (approximately 0.1 Mbits) available for data buffering and local storage.
- I/O Count 171 general‑purpose I/Os to support a broad mix of peripheral and interface connections.
- Power Supply Operates from a 3.0 V to 3.6 V supply range to match common commercial power rails.
- Package and Mounting 208‑BFQFP exposed pad (Supplier package: 208‑SQFP2, 28×28) in a surface‑mount form factor for PCB assembly.
- Operating Conditions Commercial grade device with an operating temperature range of 0 °C to 70 °C.
Unique Advantages
- Moderate logic capacity: 6,272 logic elements provide enough resources for mid‑complexity FPGA designs without excessive board area.
- Embedded memory on board: Approximately 0.1 Mbits of on‑chip RAM supports buffering and localized data storage to reduce external memory needs.
- High I/O availability: 171 I/Os give flexible connectivity options for interfacing multiple peripherals and signals.
- Compact, manufacturable package: 208‑BFQFP with exposed pad and surface‑mount footprint simplifies PCB layout in space‑constrained designs.
- Commercial‑grade suitability: Rated for 0 °C to 70 °C operation to match standard commercial product environments.
- Standard supply range: 3.0 V to 3.6 V operation aligns with common commercial power rails for easy integration.
Why Choose OR3T1256PS208-DB?
The OR3T1256PS208-DB offers a balanced combination of logic density, embedded memory, and I/O capacity in a compact 208‑BFQFP exposed pad package. As a commercial‑grade ORCA™3C FPGA from Lattice Semiconductor Corporation, it is suited to embedded system designs that require moderate programmable logic resources and substantial external interfacing within a standard surface‑mount footprint.
Choose this part when your design calls for a mid‑range FPGA option that consolidates logic, memory, and I/O into a single device while operating from common 3.0–3.6 V supplies and within commercial temperature limits. Its configuration supports straightforward board integration in applications where packaged size and I/O count are key considerations.
Request a quote or submit a pricing and availability request to move your design forward with the OR3T1256PS208-DB.

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