OR3T1256PS208I-DB

The OR3T1256PS208I-DB is an ORCA™3C Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a mid-density programmable logic fabric with 6,272 logic elements and 186,000 gates for implementing custom digital functions.

Designed for industrial applications, this surface-mount FPGA combines flexible I/O (171 pins), on-chip embedded memory, and a compact 208-BFQFP exposed pad package to support embedded control, interface aggregation, and custom logic integration in temperature-critical environments.

Key Features

• Core Logic  6,272 logic elements and 186,000 gates provide a mid-density programmable fabric suitable for custom logic implementation.
• Logic Blocks  784 logic blocks for organizing logic resources within the device.
• Embedded Memory  Approximately 0.10 Mbits (102,400 bits) of on‑chip RAM for buffering, small data tables, and state storage.
• I/O Density  171 available I/O pins to support multiple external interfaces and peripheral connections.
• Power  Operates from a 3 V to 3.6 V supply range for low-voltage system compatibility.
• Package & Mounting  208-BFQFP exposed pad package (Supplier Device Package: 208-SQFP2, 28×28) in a surface-mount form factor for thermal performance and PCB assembly.
• Operating Range  Rated for industrial temperature operation from −40 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Use the FPGA’s logic capacity and industrial temperature rating to implement motor control, PLC logic, and custom timing functions in factory equipment.
• Interface Aggregation  Leverage 171 I/O pins to gather, translate, or multiplex signals between sensors, actuators, and host processors.
• Embedded Processing and Glue Logic  Deploy the device for custom data paths, protocol bridging, and tailored peripheral control where on‑chip memory and configurable logic streamline designs.
• Prototyping and Low- to Mid-Volume Systems  The exposed pad BFQFP package and surface-mount form factor suit development platforms and production designs that require a compact, serviceable FPGA solution.

Unique Advantages

• Highly integrated mid-density logic: 6,272 logic elements and 186,000 gates reduce the need for external glue logic and discrete components.
• Substantial I/O capability: 171 I/O pins support multiple interfaces and simplify board-level signal routing for complex systems.
• On-chip memory for local buffering: Approximately 0.10 Mbits of embedded RAM enables localized data storage and small lookup tables without external memory.
• Industrial temperature rating: Operation from −40 °C to 85 °C supports deployment in temperature-demanding environments.
• Compact, thermally-aware package: 208-BFQFP exposed pad (208-SQFP2 28×28) provides a surface-mount option with thermal pad for improved heat dissipation in dense PCB layouts.
• RoHS compliant: Meets common environmental requirements for electronics manufacturing.

Why Choose OR3T1256PS208I-DB?

The OR3T1256PS208I-DB positions itself as a practical mid-density FPGA choice for industrial and embedded designs that require a balance of logic capacity, I/O count, and on‑chip memory. Backed by Lattice Semiconductor Corporation, it brings a configurable hardware platform in a compact 208-BFQFP exposed pad package suitable for surface-mount assembly and temperature-challenging environments.

Choose this part when your design requires moderate programmable logic resources, a high number of I/O, and industrial temperature capability—offering configurability and integration to streamline board-level design and reduce external components.

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