OR3T1256PS240-DB

The OR3T1256PS240-DB is an ORCA™3C family Field Programmable Gate Array (FPGA) IC providing a mid-range logic resource set in a 240‑lead BFQFP exposed‑pad package. It offers 6,272 logic elements, approximately 0.10 Mbits of on‑chip RAM (102,400 bits), and 192 user I/O pins, targeting commercial‑grade embedded designs.

With a supply range of 3.0 V to 3.6 V and a commercial operating temperature of 0 °C to 70 °C, this device is specified for surface‑mount assembly and RoHS‑compliant production environments.

Key Features

• Core Logic 6,272 logic elements (cells) and 186,000 equivalent gates provide a mid‑level programmable fabric for custom digital logic implementations.
• Embedded Memory Approximately 0.10 Mbits of on‑chip RAM (102,400 bits) to support register files, FIFOs, and small data buffers within the FPGA design.
• I/O Capacity 192 general‑purpose user I/O pins to support multiple parallel interfaces and peripheral connections.
• Package and Mounting 240‑lead BFQFP with exposed pad (supplier device package: 240‑SQFP2, 32×32) designed for surface‑mount assembly and thermal handling via the exposed pad.
• Power and Temperature Specified supply voltage range of 3.0 V to 3.6 V and commercial operating temperature range of 0 °C to 70 °C.
• Regulatory RoHS compliant for lead‑free manufacturing and regulatory alignment in commercial products.

Typical Applications

• Embedded Control — Use the 6,272 logic elements and 192 I/Os for custom control logic, protocol handling, and peripheral interfacing in commercial electronic systems.
• Interface Bridging — Implement parallel or serial interface translation and glue‑logic with ample I/O and on‑chip memory for buffering.
• Prototyping and Development — Mid‑range FPGA resources make the device suitable for functional prototypes and early product validation in commercial projects.

Unique Advantages

• Balanced Logic Density: 6,272 logic elements and 186,000 gates deliver a compromise of capacity and cost for mid‑range designs.
• Generous I/O Count: 192 user I/O pins give flexibility for connecting multiple peripherals, sensors, or external memories without external multiplexing.
• On‑Chip Memory: Approximately 0.10 Mbits of embedded RAM supports local buffering and state storage, reducing external memory needs for small datasets.
• Commercial‑Grade Specification: Rated for 0 °C to 70 °C and 3.0 V–3.6 V operation, suitable for general commercial applications and systems.
• Surface‑Mount Package with Exposed Pad: 240‑lead BFQFP with exposed pad provides a compact footprint and improved thermal path for standard PCB assembly.
• RoHS Compliant: Supports lead‑free manufacturing requirements for commercial production.

Why Choose OR3T1256PS240-DB?

The OR3T1256PS240-DB provides a practical balance of programmable logic, embedded RAM, and high I/O count in a commercial‑grade FPGA package. Its combination of 6,272 logic elements, approximately 0.10 Mbits of on‑chip memory, and 192 I/O pins makes it well suited to designers who need mid‑range FPGA resources without moving to larger devices or adding external components.

This device is appropriate for engineering teams delivering commercial embedded products that require configurable logic, flexible interfacing, and RoHS‑compliant assembly. The 240‑lead BFQFP exposed‑pad package supports standard surface‑mount manufacturing and thermal management considerations for production designs.

If you would like pricing or availability information, request a quote or submit an inquiry to begin evaluation of the OR3T1256PS240-DB for your design needs.