OR3T1257BC600-DB

The OR3T1257BC600-DB is an ORCA™3C Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides 6272 logic elements, 448 I/O pins, and on-chip embedded memory to implement configurable digital logic in commercial applications.

With a 3.0 V to 3.6 V supply range, a 0 °C to 70 °C operating temperature rating, and a 600-BGA exposed pad package for surface-mount assembly, this device targets compact, single-supply commercial designs that require moderate logic capacity and high I/O density.

Key Features

• Core Logic  6272 logic elements for implementing custom digital functions and control logic.
• On-Chip Memory  Approximately 0.10 Mbits of embedded memory (102,400 total RAM bits) to support data buffering and state storage on-chip.
• I/O Density  448 I/O pins provide extensive external connectivity for interfacing with peripherals and subsystems.
• Gate Count  186,000 gates for mapping moderate-complexity designs.
• Power Supply  Operates from a 3.0 V to 3.6 V supply, enabling use in common single-supply commercial platforms.
• Package & Mounting  600-BGA exposed pad (supplier package: 600-EBGA) in a surface-mount format for space-efficient PCB layouts and thermal conduction.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 70 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Commercial Embedded Systems  Use the device's single-supply operation and commercial temperature rating for general-purpose embedded designs that require configurable logic.
• High‑Density I/O Designs  The 448 I/O pins support applications that need many external interfaces, such as multi-channel I/O hubs or complex peripheral aggregation.
• Compact Surface‑Mount Products  The 600-BGA exposed pad package and surface-mount mounting enable compact, space-conscious board designs with improved thermal contact.
• On‑Chip Logic and Memory Integration  6272 logic elements and embedded RAM provide integrated resources for implementing custom data paths, control state machines, and on-chip buffering.

Unique Advantages

• Balanced Logic and I/O  Combines 6272 logic elements with 448 I/O pins to support designs that need both moderate on-chip logic and extensive external connectivity.
• Integrated On‑Chip RAM  Approximately 0.10 Mbits of embedded memory reduces the need for external memory in many control and buffering tasks.
• Single‑Supply Operation  3.0 V to 3.6 V supply range simplifies power architecture for commercial systems.
• Space‑Efficient Package  600-BGA exposed pad in a surface-mount format enables dense PCB layouts and a path for thermal management through the exposed pad.
• RoHS Compliant  Meets RoHS requirements for environmentally conscious manufacturing and assembly.

Why Choose OR3T1257BC600-DB?

The OR3T1257BC600-DB offers a practical combination of logic capacity, I/O count, and on‑chip memory in a compact 600-BGA exposed pad package from Lattice Semiconductor Corporation. Its commercial temperature rating and single-supply voltage range make it suitable for a wide range of commercial embedded designs where space, connectivity, and integrated resources matter.

This device is well suited to engineers and product teams seeking a configurable logic solution that balances integration and board-level density while maintaining RoHS compliance and straightforward surface-mount assembly characteristics.

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