OR3T206S208-DB
| Part Description |
ORCA™3C Field Programmable Gate Array (FPGA) IC 171 18432 1152 208-BFQFP |
|---|---|
| Quantity | 70 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-SQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 171 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH not applicable | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 144 | Number of Logic Elements/Cells | 1152 | ||
| Number of Gates | 36000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of OR3T206S208-DB – ORCA™3C Field Programmable Gate Array (FPGA) IC, 171 I/O, 1,152 logic elements, 18,432 bits RAM, 208-BFQFP
The OR3T206S208-DB is an ORCA™3C Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation supplied in a 208-pin BFQFP package. It integrates 1,152 logic elements and 18,432 bits of on-chip RAM with 171 I/O pins to support programmable digital logic implementations in commercial-grade electronic designs.
Designed for systems operating from a 3.0 V to 3.6 V supply and within a 0 °C to 70 °C commercial temperature range, this device balances moderate logic density and I/O capacity in a surface-mount form factor.
Key Features
- Core Logic 1,152 logic elements providing programmable resources for custom digital logic and control functions.
- Embedded Memory 18,432 bits of on-chip RAM to support buffering, small data tables, and state storage for finite-state machines.
- I/O Capacity 171 I/O pins to interface with multiple peripherals, sensors, and external devices in I/O-rich designs.
- Gate Equivalent Approximately 36,000 equivalent gates to describe overall logic capacity for system partitioning and design planning.
- Power and Supply Operates from a 3.0 V to 3.6 V supply, enabling straightforward integration into 3.3 V systems.
- Package and Mounting Surface-mount 208-BFQFP package (supplier device package listed as 208-SQFP, 28×28), suitable for PCB assembly in space-constrained layouts.
- Commercial Grade Rated for 0 °C to 70 °C operation and supplied as a commercial-grade device.
- Regulatory RoHS compliant for lead-free manufacturing processes.
Typical Applications
- Custom digital control — Use the 1,152 logic elements and on-chip RAM to implement application-specific control logic and finite-state machines.
- I/O aggregation and protocol bridging — 171 I/O pins enable consolidation of multiple signals and simple protocol translation within a single device.
- Embedded system glue logic — Provide programmable glue between processors, peripherals, and custom modules where moderate logic density is required.
Unique Advantages
- Balanced logic and memory capacity: Combines 1,152 logic elements with 18,432 bits of RAM to support a wide range of small- to medium-scale logic tasks without external memory for many control functions.
- High I/O count: 171 I/O pins reduce the need for external IO expanders and simplify board-level signal routing for I/O-heavy designs.
- Standard 3.3 V system compatibility: Operates from 3.0 V to 3.6 V supply rails, easing integration into common 3.3 V power domains.
- Compact surface-mount package: The 208-BFQFP (supplier noted as 208-SQFP, 28×28) provides a dense footprint suitable for PCB layouts where board area is limited.
- Commercial temperature rating: Specified 0 °C to 70 °C operation for typical commercial electronic products and environments.
- RoHS compliant: Complies with RoHS requirements for lead-free assembly processes.
Why Choose OR3T206S208-DB?
The OR3T206S208-DB positions itself as a practical, commercial-grade FPGA option for designs that need moderate programmable logic capacity combined with a high I/O count and on-chip RAM. Its specification set—1,152 logic elements, 171 I/O pins, 18,432 bits of RAM, and a 3.0 V–3.6 V supply range—makes it suitable for developers seeking a single-device solution for control, interfacing, and glue logic tasks.
From prototype to production in commercial applications, this ORCA™3C device provides a compact package and verified environmental ratings that help simplify board-level integration while meeting common regulatory requirements such as RoHS compliance.
Request a quote or submit a pricing inquiry to obtain availability and lead-time details for the OR3T206S208-DB.