OR3T206S208-DB

FPGA, 144 CLBS, 36000 GATES
Part Description

ORCA™3C Field Programmable Gate Array (FPGA) IC 171 18432 1152 208-BFQFP

Quantity 70 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package208-SQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O171Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH not applicable
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs144Number of Logic Elements/Cells1152
Number of Gates36000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of OR3T206S208-DB – ORCA™3C Field Programmable Gate Array (FPGA) IC, 171 I/O, 1,152 logic elements, 18,432 bits RAM, 208-BFQFP

The OR3T206S208-DB is an ORCA™3C Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation supplied in a 208-pin BFQFP package. It integrates 1,152 logic elements and 18,432 bits of on-chip RAM with 171 I/O pins to support programmable digital logic implementations in commercial-grade electronic designs.

Designed for systems operating from a 3.0 V to 3.6 V supply and within a 0 °C to 70 °C commercial temperature range, this device balances moderate logic density and I/O capacity in a surface-mount form factor.

Key Features

  • Core Logic 1,152 logic elements providing programmable resources for custom digital logic and control functions.
  • Embedded Memory 18,432 bits of on-chip RAM to support buffering, small data tables, and state storage for finite-state machines.
  • I/O Capacity 171 I/O pins to interface with multiple peripherals, sensors, and external devices in I/O-rich designs.
  • Gate Equivalent Approximately 36,000 equivalent gates to describe overall logic capacity for system partitioning and design planning.
  • Power and Supply Operates from a 3.0 V to 3.6 V supply, enabling straightforward integration into 3.3 V systems.
  • Package and Mounting Surface-mount 208-BFQFP package (supplier device package listed as 208-SQFP, 28×28), suitable for PCB assembly in space-constrained layouts.
  • Commercial Grade Rated for 0 °C to 70 °C operation and supplied as a commercial-grade device.
  • Regulatory RoHS compliant for lead-free manufacturing processes.

Typical Applications

  • Custom digital control — Use the 1,152 logic elements and on-chip RAM to implement application-specific control logic and finite-state machines.
  • I/O aggregation and protocol bridging — 171 I/O pins enable consolidation of multiple signals and simple protocol translation within a single device.
  • Embedded system glue logic — Provide programmable glue between processors, peripherals, and custom modules where moderate logic density is required.

Unique Advantages

  • Balanced logic and memory capacity: Combines 1,152 logic elements with 18,432 bits of RAM to support a wide range of small- to medium-scale logic tasks without external memory for many control functions.
  • High I/O count: 171 I/O pins reduce the need for external IO expanders and simplify board-level signal routing for I/O-heavy designs.
  • Standard 3.3 V system compatibility: Operates from 3.0 V to 3.6 V supply rails, easing integration into common 3.3 V power domains.
  • Compact surface-mount package: The 208-BFQFP (supplier noted as 208-SQFP, 28×28) provides a dense footprint suitable for PCB layouts where board area is limited.
  • Commercial temperature rating: Specified 0 °C to 70 °C operation for typical commercial electronic products and environments.
  • RoHS compliant: Complies with RoHS requirements for lead-free assembly processes.

Why Choose OR3T206S208-DB?

The OR3T206S208-DB positions itself as a practical, commercial-grade FPGA option for designs that need moderate programmable logic capacity combined with a high I/O count and on-chip RAM. Its specification set—1,152 logic elements, 171 I/O pins, 18,432 bits of RAM, and a 3.0 V–3.6 V supply range—makes it suitable for developers seeking a single-device solution for control, interfacing, and glue logic tasks.

From prototype to production in commercial applications, this ORCA™3C device provides a compact package and verified environmental ratings that help simplify board-level integration while meeting common regulatory requirements such as RoHS compliance.

Request a quote or submit a pricing inquiry to obtain availability and lead-time details for the OR3T206S208-DB.

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