OR3T206S208I-DB

The OR3T206S208I-DB is an ORCA™3C field programmable gate array (FPGA) packaged in a 208‑BFQFP surface‑mount case. It integrates 1,152 logic elements, on‑chip RAM, and a large complement of I/O to support compact, reconfigurable digital designs.

Designed and specified for industrial use, this device targets embedded and control applications that require a mid‑density FPGA with extended temperature range and standard 3.0–3.6 V supply compatibility.

Key Features

• Core Logic — 1,152 logic elements (LEs) providing a total of 36,000 gates for mid‑density programmable logic implementations.
• Embedded Memory — 18,432 bits of on‑chip RAM to support small data buffers, state machines, and local storage requirements.
• I/O Capacity — 171 user I/O pins suitable for interfacing a broad range of peripherals, sensors, and external logic.
• Power Supply — Operates from 3.0 V to 3.6 V supplies, enabling compatibility with common single‑supply systems.
• Package & Mounting — 208‑BFQFP surface‑mount package (supplier device package: 208‑SQFP, 28 × 28) for high‑density board designs.
• Operating Temperature — Industrial temperature grade: −40 °C to 85 °C for deployment in temperature‑sensitive environments.
• Regulatory — RoHS compliant, supporting lead‑free manufacturing processes.

Typical Applications

• Industrial Control — Implement custom control logic, I/O aggregation, and deterministic sequencing in factory and machine automation systems.
• Embedded Systems — Act as a reconfigurable logic engine in embedded platforms that require moderate logic density and on‑chip memory.
• I/O Expansion and Protocol Bridging — Provide flexible pin counts and programmable interfaces for interfacing sensors, actuators, and external peripherals.
• Prototyping and Development — Evaluate mid‑density FPGA architectures and validate digital designs prior to system integration.

Unique Advantages

• Balanced Logic and Gate Count: 1,152 logic elements and 36,000 gates deliver a midpoint between small CPLDs and larger FPGAs for cost‑effective designs.
• Compact Embedded Memory: 18,432 bits of RAM enable local buffering and state storage without external memory in many control and interface tasks.
• High I/O Density: 171 I/O pins support extensive peripheral connections while keeping PCB routing and system complexity manageable.
• Industrial Temperature Rating: −40 °C to 85 °C operation allows deployment in a wide range of industrial environments.
• Industry‑Standard Supply Voltage: 3.0–3.6 V supply support simplifies integration with common system power rails.
• Surface‑Mount Package: 208‑BFQFP (28 × 28 SQFP footprint) offers a reliable, manufacturable package for production assemblies.

Why Choose OR3T206S208I-DB?

The OR3T206S208I-DB delivers a practical mix of logic resources, embedded RAM, and I/O capacity in an industrial‑grade FPGA package. Its 1,152 logic elements, 18,432 bits of on‑chip memory, and 171 I/Os make it well suited for embedded control, I/O management, and mid‑density programmable logic tasks where robustness and a standard 3.0–3.6 V supply are important.

For designers seeking a scalable, reconfigurable component with industrial temperature capability and a compact surface‑mount footprint, this ORCA™3C device provides a dependable building block that helps reduce board-level complexity while maintaining flexibility for future revisions.

Request a quote or submit an RFQ to get pricing and availability for the OR3T206S208I-DB and to discuss quantity, lead time, and packaging options.