OR3T207BA256-DB
| Part Description |
ORCA™3C Field Programmable Gate Array (FPGA) IC 192 18432 1152 256-BGA |
|---|---|
| Quantity | 960 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-PBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 192 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 144 | Number of Logic Elements/Cells | 1152 | ||
| Number of Gates | 36000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of OR3T207BA256-DB – ORCA™3C Field Programmable Gate Array (FPGA) IC 192 18432 1152 256-BGA
The OR3T207BA256-DB is a commercial-grade ORCA™3C field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It provides a compact, surface-mount FPGA solution in a 256-BGA (27×27) package with support for up to 1152 logic elements and 192 I/O pins.
This device is targeted at commercial embedded designs that require flexible programmable logic, on-chip memory, and a moderate I/O count, while operating from a 3.0 V to 3.6 V supply and within a 0 °C to 70 °C temperature range.
Key Features
- Core Logic — 1152 logic elements providing programmable logic capacity suitable for glue logic, protocol handling, and control functions.
- On‑Chip Memory — 18,432 bits of embedded RAM for small buffers, FIFOs, and state storage directly on the FPGA fabric.
- I/O Density — 192 programmable I/O pins to support multiple interfaces and peripheral connections without external I/O expanders.
- Gate Count — Approximately 36,000 gates to enable integration of control, interfacing, and signal-processing tasks within a single device.
- Package & Mounting — 256‑BGA (27×27) package designed for surface-mount assembly, conserving PCB area while delivering high pin-count routing.
- Power — Operates from a 3.0 V to 3.6 V supply range for compatibility with common commercial power rails.
- Temperature & Grade — Commercial grade with an operating range of 0 °C to 70 °C, suitable for consumer and general commercial applications.
- Compliance — RoHS compliant to meet common environmental requirements for electronic assemblies.
Typical Applications
- Consumer Electronics — Implement control logic, custom interfaces, and peripheral management in consumer devices where commercial temperature operation is required.
- Embedded Control — Manage local control tasks, glue logic, and timing-critical functions in compact embedded systems using the on‑chip RAM and logic elements.
- Interface Bridging — Bridge multiple serial or parallel peripherals with the device's 192 I/O pins, reducing external component count.
- Prototyping and Evaluation — Use the programmable fabric and accessible I/O for design exploration, proof-of-concept development, and quick system validation.
Unique Advantages
- Moderate Logic Capacity: 1152 logic elements provide a balanced level of programmable resource for control and interfacing tasks without overprovisioning.
- Integrated Memory: 18,432 bits of embedded RAM enable localized buffering and state retention, reducing the need for external memory in many designs.
- High I/O Count in a Compact Package: 192 I/Os in a 256‑BGA (27×27) package deliver significant connectivity in a space-efficient footprint.
- Standard Commercial Voltage: 3.0 V to 3.6 V supply compatibility simplifies power-supply design for common commercial systems.
- RoHS Compliant: Environmentally compliant manufacturing meets customer requirements for lead‑free assemblies.
Why Choose OR3T207BA256-DB?
The OR3T207BA256-DB is positioned for commercial embedded designs that need a compact, surface-mount FPGA with a balanced mix of logic, memory, and I/O. Its 1152 logic elements, 18,432 bits of on-chip RAM, and 192 I/O pins make it well suited for integrating control, interface bridging, and peripheral management into a single device while maintaining a small PCB footprint.
Designers seeking a RoHS-compliant FPGA that operates from common 3.0 V–3.6 V rails and within a commercial temperature range will find this ORCA™3C device suitable for a variety of consumer and commercial applications where moderate programmable capacity and flexible I/O are required.
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Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016